Cleaning method of support plate and application thereof

Abstract

The invention discloses a support plate cleaning method and application thereof, and belongs to the technical field of support plate cleaning. A cleaning method of a carrier plate comprises the steps that S100, pre-coating treatment is conducted on the carrier plate, so that a pre-coating film layer is formed on the surface of the carrier plate, and the material of the pre-coating film layer comprises metal oxide which is not resistant to acid; s200, a silicon wafer is placed in the carrier plate obtained in the step S100, the carrier plate serves as a silicon wafer coating carrier to conduct coating treatment on the silicon wafer, and after coating treatment, a transparent conductive film is formed on the surface of the carrier plate; and S300, carrying out acid pickling on the carrier plate in the step S200 so as to remove the pre-coated film layer and the transparent conductive film on the surface of the carrier plate. The cleaning effect of the carrier plate can be improved, deformation of the carrier plate can be avoided in the cleaning process, and repeated utilization of the carrier plate can be achieved.

Description

technical field [0001] The application belongs to the technical field of carrier board cleaning, and in particular relates to a method for cleaning a carrier board and its application. Background technique [0002] In the field of photovoltaic cell manufacturing, the tool used to carry the device is usually used, that is, the carrier plate. The carrier plate is a tool used to carry silicon wafers in the production process of photovoltaic cells. Usually, the silicon wafers are placed in the holes on the carrier plate to realize the simultaneous completion of the upper and lower surfaces of the silicon wafer in a coating machine. For coating, for example, the upper surface is coated with a downward sputtering cathode, and the lower surface is coated with an upward sputtering cathode. The coating film formed on the surface of the silicon wafer is a transparent conductive film, usually an ITO (Indium Tin Oxide, tin-doped indium oxide) film, and of course other types of transpar...

AI Technical Summary

Problems solved by technology

However, due to the good corrosion resistance of the ITO film, it is difficult to clean it with acid cleaning, and it is necessary to continue the sandblasting treatment, which will easily cause the deformation of the carrier plate during the sandblasting treatment, and easily cause damage to the carrier plate, resulting in Faults occurred during the subsequent installation of silicon wafers, which made the carrier board no longer reusable, which increased the cost and affected the production efficiency

[0004] Therefore, the problem of easy deformation of the carrier plate in the cleaning process of the carrier plate cleaning method in the related art needs to be improved.

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