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Method for optimizing DMD exposure through dislocation superposition

An image and sub-frame technology, which is applied in the field of dislocation superimposition to optimize DMD exposure, can solve problems such as image edge jaggedness, and achieve the effect of improving graphic breakage and reducing errors

Pending Publication Date: 2022-03-25
CHANGCHUN UNIV OF SCI & TECH
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Problems solved by technology

[0004] In order to solve the problem that there are gaps on the image surface and jagged edges of the image in the existing method, the present invention provides a method for optimizing DMD exposure by dislocation superimposition

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  • Method for optimizing DMD exposure through dislocation superposition
  • Method for optimizing DMD exposure through dislocation superposition
  • Method for optimizing DMD exposure through dislocation superposition

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Embodiment Construction

[0019] combine Figure 1 to Figure 6 Describe this implementation mode, a method for optimizing DMD exposure by dislocation stacking, such as figure 1 It is a mathematical model of DMD micromirror energy distribution.

[0020] The main reason for improving the problem of pattern breakage is the structure of the DMD itself. At present, the size of the usual DMD pixel unit is 13.68 μm, the effective pixel size is 12.68 μm, and there is a 1 μm interval between adjacent pixels. Therefore, under ideal conditions, the energy on each micromirror has a Gaussian distribution, and there are large defects in the center of the rectangle formed by every four adjacent pixels between every two pixels, causing pattern breaks.

[0021] The energy distribution of each micromirror of an ideal DMD is not uniform, figure 1 It is the energy distribution diagram of the DMD micromirror. The energy on each micromirror is Gaussian distributed, and the exposure energy is attenuated around the center o...

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Abstract

The invention discloses a method for optimizing DMD exposure through dislocation superposition, relates to the technical field of DMD imaging, and solves the problems that gaps exist on the surface of an image and sawteeth appear on the edge of the image in an existing method. Exposing a 1 / 2 pixel size image of the original image to generate a sub-frame image; according to the method, three times of staggered superposition are utilized to solve the problem of image breakage, internal and external coherence factors of the annular light source are optimized to fill up light intensity subsection depression, and the phenomenon of image breakage is improved. The method comprises the following steps of: overlapping an original image in a 45-degree direction with a 1 / 2 pixel size, overlapping in an X-axis direction with a 1 / 2 pixel size and overlapping in a Y-axis direction with a 1 / 2 pixel size on the original image, and overlapping in a Y-axis direction with a 1 / 2 pixel size on the original image. According to the exposure method provided by the invention, under the condition that the original sawtooth is about one pixel size, the error is reduced by 50%, and the image has no gap.

Description

technical field [0001] The invention relates to the technical field of DMD imaging, in particular to a method for optimizing DMD exposure by dislocation superimposition. Background technique [0002] The DMD micro-mirror is mainly composed of four layers, which are micro-mirror unit, connecting hinge, addressing electrode, spring contact and static memory (RAM). The micro-mirror unit is connected with the torsion arm beam and is jointly supported by the hinge support column, and the micro-mirror unit in a suspended state can rotate around the hinge axis. The hinge shaft is connected to the electrodes, and the state of the electrodes is stored in the static memory. Changing the voltage of the electrodes can control the deflection angle of the micro-mirror unit and determine the switching state of the pixel. [0003] Due to the uneven energy distribution of each micromirror in the exposure of DMD lithography, the exposure energy decays from the center of the micromirror to th...

Claims

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Application Information

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IPC IPC(8): G03F7/20
CPCG03F7/2022G03F7/2026
Inventor 王英志盖春宇王酌胡俊韩太林
Owner CHANGCHUN UNIV OF SCI & TECH
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