Package with base island isolation frame and substrate chip sealed together and preparation method of package with base island isolation frame and substrate chip sealed together

Abstract

The invention discloses a packaging part for sealing a base island isolation frame and a substrate chip and a preparation method thereof, and the method comprises the steps: spraying an adhesive with the thickness of 25-45 microns at the bonding position of a substrate and an isolation chip on the base island isolation structure frame, and sequentially bonding the substrate and the isolation chip on the base island isolation structure frame through a 2D chip mounting technology, the combination of the substrate, the isolation chip and the base island isolation structure frame is realized, the integrated packaging of a multifunctional module is realized, the substrate and the isolation chip are electrically connected through a bonding wire by applying a wire bonding technology, and then the surfaces of the substrate, the isolation chip, the bonding wire and the base island isolation structure frame are covered with a high-temperature-resistant and high-pressure-resistant plastic package material, so that a plastic package body package is realized. The manufacturing process of an existing isolation product is optimized, the production efficiency of the existing product is improved, and the abnormal problems of creepage, high-voltage discharge and the like of the existing product are solved, so that the product packaging cost is reduced, and the product quality and reliability are improved.

Description

technical field [0001] The invention belongs to the field of integrated circuit packaging applications, and relates to the invention of a SIP-level isolation structure manufacturing and packaging production method, specifically the production of bonding substrates and isolation chips with electronic functions to the frame of a multi-row double-island isolation structure in a 2D manner Way. Background technique [0002] The packaging of integrated circuit devices has changed from the development of a single component to the integration of multiple components, and semiconductor packaging has gradually developed to high density, high integration, high frequency and high speed, small area, low cost, multi-chip combination, and with different functions. Active electronic components, optional passive component assembly trend development, integration. From the perspective of packaging development, considering the volume, processing speed or electrical characteristics of electronic...

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Problems solved by technology

[0004] The purpose of the present invention is to overcome the existing technical defects, develop SOP300mil16L double-base island isolation frame, and solve product quality problems caused by high-voltage isolation products such as creepage, high-voltage discharge, and Support bar structure from the design scheme

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