Photosensitive element, manufacturing method, photosensitive chip, photosensitive detector and detection device
A photosensitive element and photosensitive technology, applied in the field of photosensitive elements, can solve the problems of large occupied area of photosensitive elements and reduced wafer area utilization rate, etc.
Pending Publication Date: 2022-04-05
HANGZHOU HIKVISION DIGITAL TECH
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Problems solved by technology
[0003] There are at least the following technical problems in the prior art: the photosensitive element occupies a large area on the wafer, which reduces the area utilization of the wafer
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[0057] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0058] In the description of the present invention, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", The orientation or positional relationship indicated by "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying The device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the invention.
[0059] The terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implicitly indicating the...
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The invention discloses a photosensitive element, a manufacturing method, a photosensitive chip, a photosensitive detector and a detection device, relates to the technical field of photosensitive elements, and solves the technical problem that the area utilization rate of a wafer is reduced due to the fact that the photosensitive element occupies a large area on a semiconductor substrate in the prior art. The photosensitive element includes a semiconductor substrate, a circuit structure layer, and a conductive portion. The semiconductor substrate includes a backlight surface. A photosensitive part is formed in the semiconductor substrate, and the photosensitive part is used for converting an optical signal into an electric signal. The circuit structure layer is arranged on one side of the backlight surface and is adjacent to the semiconductor substrate. The conductive part penetrates through the circuit structure layer and is electrically connected with the photosensitive part. And the vertical projection of the conductive part on the semiconductor substrate is located in the range of the vertical projection of the photosensitive part on the semiconductor substrate. The photosensitive element disclosed by the invention is used for converting an optical signal into an electric signal.
Description
technical field [0001] The present invention relates to the technical field of photosensitive elements, and in particular, to a photosensitive element, a manufacturing method of a photosensitive element, a photosensitive chip, a photosensitive detector and a detection device. Background technique [0002] In the prior art, photosensitive elements are generally used in fields such as security inspection, industrial non-destructive testing, and medical treatment, and are used to convert received optical signals into electrical signals. The photosensitive element is usually fabricated on a wafer, and after the fabrication is completed, the wafer is cut so that the photosensitive element can be separated from other components on the wafer. [0003] There are at least the following technical problems in the prior art: the photosensitive element occupies a large area on the wafer, which reduces the area utilization rate of the wafer. SUMMARY OF THE INVENTION [0004] In order t...
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Inventor 刘广元李佳轩
Owner HANGZHOU HIKVISION DIGITAL TECH