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Micro-electro-mechanical system

A technology of micro-electromechanical systems and conductive elements, applied in electrical components, electrostatic sensors, electrostatic transducer microphones, etc., can solve problems such as difficulty in achieving reasonable sensitivity, avoid extrusion film damping and rotational resistance, and low noise conduction. , Improve the effect of mechanical reliability

Pending Publication Date: 2022-04-05
AAC ACOUSTIC TECH (SHENZHEN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, compared to the diaphragm, the high stiffness of the moving and fixed comb electrode fingers makes the compliance of the diaphragm more important, which makes it difficult to achieve low gain using Application Specific Integrated Circuit (ASIC) Reasonable Sensitivity Target

Method used

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  • Micro-electro-mechanical system
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Embodiment Construction

[0036] The invention will be further described with reference to the accompanying drawings. It should be noted that elements of similar structure or function are denoted by similar numerals in the figures. These embodiments are not intended to be exhaustive or to describe the various embodiments, or as limitations on the scope of the claims or some other scope that one of ordinary skill in the art can obtain based on the described embodiments of the present invention. Furthermore, the illustrated embodiments do not necessarily present all aspects or advantages.

[0037] see Figure 1-Figure 4 , the MEMS 10 includes a back plate 20 , a diaphragm 40 movable relative to the back plate 20 based on a pressure applied thereto, and an insulator 60 arranged at a peripheral portion of the diaphragm 40 and the peripheral portion of the back plate 20 . In some embodiments, MEMS 10 further includes a substrate 80 . The backplane 20 is installed on the substrate 80 .

[0038] The back ...

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Abstract

A micro-electro-mechanical system includes a backplate and a diaphragm. The back plate comprises a plurality of stator elements which are arranged at intervals, gaps are formed among the stator elements, and each stator element comprises a first conductive element; and the diaphragm comprises a plurality of folds corresponding to the plurality of gaps respectively, each fold comprises a groove formed on the surface far away from the backboard, and the fold comprises a second conductive element. The diaphragm moves relative to the back plate in response to the applied pressure, so that the wrinkles move into or out of the corresponding gaps, and the capacitance formed between the first conductive element and the second conductive element is changed. The wrinkles are defined by grooves formed away from the surface of the back plate, which facilitates controlling the flexibility of the diaphragm and reducing the stiffness of the diaphragm. The pleats may form a lower aspect ratio, which allows it to be formed using a standard front-side process.

Description

technical field [0001] The present invention relates to the field of electroacoustic conversion devices, in particular to a microelectromechanical system (Microelectromechanical System, MEMS) used for the electroacoustic conversion device. Background technique [0002] Micro-electro-mechanical systems are widely used in electro-acoustic conversion devices. A typical MEMS includes a back plate, a diaphragm opposite to the back plate, fixed comb teeth attached to the back plate, and moving comb teeth attached to the diaphragm. The moving and fixed combs consist of electrode fingers that typically have high aspect ratios and mechanical stiffness orders of magnitude higher than the diaphragm. The displacement of the diaphragm causes the relative displacement between the moving and fixed comb teeth. The displacement causes the output voltage to change proportionally with the displacement of the moving and fixed comb teeth. A particular advantage of MEMS is that the moving and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/00H04R19/04H04R31/00
CPCB81B2201/0257B81B2203/0127B81B2201/033B81B3/007B81B2203/0346B81B3/0086B81B2203/0136
Inventor 斯科特·莱尔·嘉吉
Owner AAC ACOUSTIC TECH (SHENZHEN) CO LTD