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Semiconductor discrete component line type detection method and detection equipment

A technology of discrete components and detection methods, used in image analysis, image data processing, instruments, etc., can solve the problems of long time consumption and low flexibility of detection methods, and achieve the effect of short time consumption, high flexibility, and low resource consumption.

Pending Publication Date: 2022-04-12
GUANGDONG ZHENGYE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a semiconductor discrete component linear detection method and detection equipment to solve the problem of low flexibility and time-consuming detection means

Method used

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  • Semiconductor discrete component line type detection method and detection equipment
  • Semiconductor discrete component line type detection method and detection equipment
  • Semiconductor discrete component line type detection method and detection equipment

Examples

Experimental program
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Embodiment 1

[0060] This embodiment provides a method for detecting the line type of semiconductor discrete components, which is mainly applied to the scene of detecting the line type of semiconductor discrete components. By optimizing the image processing method, it is more flexible and time-consuming. Shorter and consumes less resources.

[0061] Such as figure 1 As shown, the semiconductor discrete element linear detection method of the present embodiment includes:

[0062] S100, preset the filter window of the mean value filter, the width w and the height h of the filter window are not equal;

[0063] S200. Acquire the discrete component image I(x, y) of the semiconductor discrete component; wherein, the discrete component image I(x, y) is obtained by shooting the semiconductor discrete component through X-ray; wherein the discrete component image I(x, y) is as follows figure 2 As shown, including the wire part (wire), the pin part (pin) and the ball part (ball), the separate acquis...

Embodiment 2

[0120] The detection device provided in this embodiment includes a memory and a processor. The memory stores a control program that can run on the processor. When the control program is executed by the processor, the method for detecting the line pattern of semiconductor discrete components as in Embodiment 1 is implemented. The specific steps and technical effects of the method for detecting the line shape of semiconductor discrete components are described in Embodiment 1. The detection equipment of this embodiment uses this method and also has its technical effects.

[0121] To sum up, the detection equipment provided by this embodiment can simply and quickly calculate the distance between the coordinates of the center of the solder ball and determine whether the semiconductor discrete component is NG. Advantages of short time consumption.

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Abstract

The invention discloses a linear detection method for a semiconductor discrete component. The linear detection method comprises the following steps: respectively carrying out mean filtering on a square of a discrete component image and the discrete component image by using a preset window to obtain a filtered image; then a local standard deviation image is obtained through calculation according to a standard deviation calculation formula, the first filtering image and the second filtering image, a local welding line image is obtained through extraction based on the local standard deviation image, and due to the fact that parameters w and h are different, the target of restraining a gradient value in a certain direction is achieved, and higher flexibility is achieved; obtaining a solder ball center coordinate from the discrete component image, and finally judging whether the semiconductor discrete component is NG or not according to a preset NG standard, a bonding wire coordinate set S of the local bonding wire image and the solder ball center coordinate. The interference of irrelevant gradients is extracted and filtered out from the local bonding wire image, so that the distance between the local bonding wire image and the central coordinate of the solder ball can be simply and quickly calculated to judge whether the discrete semiconductor component is NG or not, the consumed time is short, and the occupied resources are few.

Description

technical field [0001] The invention relates to the field of semiconductor chip production and manufacturing, in particular to a method and equipment for detecting the line shape of semiconductor discrete components. Background technique [0002] The line type detection of semiconductor discrete components is an important step in the manufacturing process of semiconductor chips. At present, the line type detection of semiconductor discrete components adopts the means of manual visual inspection. This method has a low level of automation, long hours of work can easily make employees feel tired, and the detection results are easily affected by subjective factors such as emotions, resulting in a decrease in detection accuracy. [0003] Therefore, some technicians in the prior art proposed to use Laplace edge detection operator to detect the edge of the semiconductor line, obtain an edge image after edge enhancement, and then conduct training through deep learning or neural netw...

Claims

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Application Information

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IPC IPC(8): G06T7/00G06T7/11G06T7/13G06T7/136
Inventor 叶兆斌魏承锋徐同
Owner GUANGDONG ZHENGYE TECH