Packaging structure and packaging process of lead frame

Abstract

The invention belongs to the technical field of lead frame packaging structures, and particularly relates to a lead frame packaging structure and a packaging technology thereof.The lead frame packaging structure comprises an upper sealing cover and a lower sealing seat, the lower sealing seat is provided with a containing groove, and the two sides of the lower sealing seat are each provided with a plurality of pin grooves matched with the containing groove; the upper sealing cover is fixedly connected with a pressing block matched with the pin groove, the lower sealing base is provided with two lifting mechanisms, the output ends of the two lifting mechanisms are both fixedly connected with the upper sealing cover, and a linkage mechanism is arranged between the two lifting mechanisms. According to the packaging structure, the packaging link can be greatly optimized, meanwhile, collision stress borne by a chip on the lead frame can be effectively buffered in the packaging use process, waste energy can be effectively utilized so as to assist in improving the heat dissipation performance in the packaging structure in the working process, meanwhile, dust on a dustproof net can be effectively removed, and the packaging structure is convenient to use. And static electricity on the bristles can be eliminated, so that the bristles are prevented from adsorbing dust.

Description

technical field [0001] The invention belongs to the technical field of lead frame packaging structure, and in particular relates to a lead frame packaging structure and a packaging process thereof. Background technique [0002] As the chip carrier of integrated circuits, the lead frame is a key structural component that realizes the electrical connection between the lead-out end of the internal circuit of the chip and the external lead by means of bonding materials to form an electrical circuit. It plays the role of a bridge connecting with external wires. Most of the semiconductor integrated blocks need to use lead frames, which is an important basic material in the electronic information industry. [0003] Nowadays, in the process of encapsulating the lead frame, it often needs to be sealed by the shell to provide protection for the lead frame and the chips on it. The shell used for external encapsulation is generally composed of an upper shell and a lower shell. In this ...

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Problems solved by technology

[0003] Nowadays, in the process of encapsulating the lead frame, it often needs to be sealed by the shell to provide protection for the lead frame and the chips on it. The shell used for external encapsulation is generally composed of an upper shell and a lower shell. In this case, the user needs to fix the connection points of the upper shell and the lower shell in turn through multiple bolts, which is relatively cumbersome, and the traditional packaging structure generally only provides heat dissipation ports on the shell for heat dissipation, and the heat dissipation effect is poor. In addition, due to The chip is fixed on the lead frame by glue, which makes the glue easy to be thermally expanded to generate stress, which affects the stability of the chip connection point

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