High-reliability semiconductor device chip welding method
A technology of device chips and welding methods, applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts and other directions, can solve the problems of chips prone to empty welding or virtual welding, affecting the stability of chips, etc., to avoid The effect of virtual soldering and empty soldering, stable chip operation and quality improvement
Pending Publication Date: 2022-04-15
山东沂光集成电路有限公司
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Problems solved by technology
[0004] The purpose of the present invention is to provide a method for bonding chips of semiconductor devices with high reliability, which aims to improve some deficiencies in the existing chip bonding methods, that is, the center of the chip is prone to empty soldering or virtual soldering. Issues that will affect the stability of the later operation of the chip
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[0032] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0033] In the description of the present invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc. indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only In order to facilitate the description of the present invention and simplify the description, it does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in ...
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The invention discloses a high-reliability semiconductor device chip welding method, which comprises the following steps of: 1, applying paste to a chip, namely applying the paste to a connecting plate arranged on the chip; step 2, chip reballing: reballing is carried out on a reballing position arranged on the connecting plate; step 3, ball mounting inspection: placing the connecting plate under a microscope for observation, and accurately placing the connecting plate on the ball mounting position when the solder ball is seen; 4, heating and fixing are conducted, specifically, the connecting plate obtained after ball mounting is completed is placed on a heating table, and the connecting plate is heated; step 5, cooling and cleaning: when the solder balls are completely adhered to the ball mounting positions, cooling the connecting plate subjected to ball mounting, and cleaning the cooled connecting plate; and 6, grabbing the chip, aligning the suction cup with the suction cup alignment seat, and carrying out adsorption. Through the welding method set by the invention, the conditions of pseudo soldering and missing soldering can be effectively avoided, so that the welding quality of the chip can be improved, and the chip can run more stably.
Description
technical field [0001] The invention relates to the technical field of chip welding, in particular to a high-reliability semiconductor device chip welding method. Background technique [0002] With the development of science and technology, semiconductor devices and components have been widely used in engineering and business. Its large number of applications in radar, remote control telemetry, aerospace, etc. put forward higher requirements for its reliability, and the welding (pasting) method of the chip is also a very important part of its reliability; because the quality of the chip welding is good or bad. Will directly affect the stability of its work. [0003] However, there are some shortcomings in the existing chip welding method, that is, the center of the chip is prone to empty welding or virtual welding, which will affect the stability of the later operation of the chip. Contents of the invention [0004] The purpose of the present invention is to provide a me...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L21/60H01L23/31
CPCH01L23/3128H01L24/11H01L24/81H01L2224/111H01L2224/8134
Inventor 路尚伟王兴超孟庆卢林延峰
Owner 山东沂光集成电路有限公司