Full-automatic film pasting all-in-one machine for semiconductor wafer

Abstract

The invention belongs to the technical field of semiconductor equipment, and discloses a semiconductor wafer full-automatic film pasting all-in-one machine which is technically characterized by comprising a workbench, a film pasting cavity is inwards formed in the surface of the workbench, a plurality of sets of containing cylinders are fixedly installed on the bottom wall of the film pasting cavity towards the interior of the workbench, and feeding mechanisms are arranged in the containing cylinders; the feeding mechanism comprises a bottom plate, an extrusion part and a lifting part, multiple sets of control rods are arranged between the inner walls of the film pasting cavity, extrusion rollers are installed on the surfaces of the control rods, a swing assembly connected with the control rods is installed on the surface of the workbench, and a limiting mechanism is arranged at an opening of the containing cylinder. The limiting mechanism comprises a telescopic part and a clamping part, and an automatic film cutting assembly located on the outer side of the limiting mechanism is arranged at an opening of the containing barrel. The problem that in the film pasting process of existing film pasting equipment, bubbles are likely to be generated between a protective film and the surface of a wafer, and the film pasting quality is affected is solved; and an existing film pasting device needs to carry out feeding and film pasting on the wafer manually, and the efficiency is low.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to an all-in-one machine for fully automatic film sticking of semiconductor wafers. Background technique [0002] Wafer is the basic raw material for making semiconductor electrical components. It is mainly cut from silicon rods. When the wafer is processed and produced, it usually needs to be treated with a film on its surface to protect the surface of the wafer. In actual use, it is usually necessary to cut and slice the wafer, which can effectively improve the utilization rate of the wafer and avoid waste of the wafer. [0003] Before cutting the wafer, it is necessary to stick a film on the surface of the wafer to protect the wafer, but the existing film sticking equipment is used to stick the film horizontally on the wafer, and it is easy to get stuck between the protective film and the wafer surface during the film sticking process. The air bubbles generated b...

AI Technical Summary

Problems solved by technology

[0003] Before cutting the wafer, it is necessary to stick a film on the surface of the wafer to protect the wafer, but the existing film sticking equipment is all horizontally sticking the film on the wafer, and it is easy to get stuck between the protective film and the wafer surface during the film sticking The air bubbles generated between them will affect the quality of the film attachment, and the existing film attachment equipment needs to manually load the wafer, and the film attachment efficiency is low

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