One-way heat transfer heat pipe with Y-shaped flow guide table wick and machining method of one-way heat transfer heat pipe

Abstract

The invention provides a Y-shaped flow guide table wick one-way heat transfer heat pipe and a machining method thereof, and relates to the technical field of heat dissipation elements, the Y-shaped flow guide table wick one-way heat transfer heat pipe comprises a first heat transfer assembly and a second heat transfer assembly, and flow guide grooves are formed in the first heat transfer assembly and / or the second heat transfer assembly; the sides, provided with the flow guide grooves, of the first heat transfer assembly and the second heat transfer assembly are connected with each other to form a closed flow guide cavity, a plurality of Y-shaped flow guide tables in the same direction are evenly arrayed on the bottom face and the top face of the flow guide cavity respectively, and working media are contained in the flow guide cavity. The working medium in the flow guide cavity is subjected to one-way flow guide through the Y-shaped flow guide table, so that one-way heat transfer of the first heat transfer assembly and the second heat transfer assembly is achieved, and electronic elements are effectively protected against high-temperature damage; in addition, due to the structure that the Y-shaped flow guide tables are combined for flow guide on the surface, the machining process is simple, and compared with an existing laser engraving machining technology, cost is lower, technical limitation is small, and universality is higher.

Description

technical field [0001] The invention relates to the technical field of heat dissipation elements, in particular to a Y-shaped guide table liquid-absorbing core one-way heat transfer heat pipe and a processing method thereof. Background technique [0002] With the emergence of various high-power electronic products, how to better dissipate them has become an accompanying problem. As an efficient heat transfer element, heat pipes are widely used for heat dissipation of electronic devices; traditional heat pipes are bidirectional, that is, heat transfer in two directions can be realized, and the direction of heat transfer depends on the high temperature at both ends, that is, from the high temperature section to the low temperature section. [0003] Under normal working conditions, heating elements (such as chips, etc.) are in the high temperature section, and heat dissipation elements are in the low temperature section. The heat pipe transfers the temperature of the heating e...

AI Technical Summary

Problems solved by technology

However, when an electronic device fails, the temperature of the cooling element will be higher than that of the heating element, which will transmit the temperature of the outside world to the heating element, causing damage to the heating element (such as a chip, etc.), resulting in huge losses

[0004] Existing heat pipes mainly use laser engraving technology to process micro-grooves on metal sheets as liquid-absorbing cores. Therefore, this type of heat pipe transports liquid through the microstructure under the surface, and the processing technology is complicated and the cost is high.

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