L-band down-conversion SIP module and manufacturing method thereof

Abstract

The invention relates to the technical field of down converters, in particular to an L-band down-conversion SIP module and a manufacturing method thereof. The L-band down-conversion SIP module comprises a tube shell, a lower-layer microwave multi-chip module circuit and an upper-layer microwave multi-chip module circuit; the upper-layer microwave multi-chip module circuit is located above the lower-layer microwave multi-chip module circuit, and the upper-layer microwave multi-chip module circuit and the lower-layer microwave multi-chip module circuit are arranged in a laminated mode to form three-dimensional layout of the circuits, so that the defects that traditional L-band down-conversion is diversified in appearance and large in size are overcome; particularly, the upper-layer microwave multi-chip module circuit and the lower-layer microwave multi-chip module circuit are electrically connected through the metal balls, so that the electric connection of the upper-layer circuit and the lower-layer circuit is realized, and the three-dimensional arrangement of the upper-layer microwave multi-chip module circuit and the lower-layer microwave multi-chip module circuit is also ensured; compared with a traditional cable and a traditional connector, the metal ball is smaller in transmission loss.

Description

technical field [0001] The invention relates to the technical field of down-converters, in particular to an L-band down-conversion SIP module and a manufacturing method thereof. Background technique [0002] Based on microelectronics technology, multi-functional chip application and three-dimensional micro-assembly technology, seek the development of integration and miniaturization of microwave products. Microwave multi-chip module (Multi-ChipModule, MCM) is a combination of multiple microwave chips and other small discrete The devices are assembled on the same microwave interconnect substrate, and then packaged as a whole to form a high-density multi-chip microwave component. Compared with the traditional microwave hybrid integrated circuit (HybridIntegratedCircuit, HIC), MCM has the characteristics of small size and high integration density. Usually, all components are placed on the same plane, and MCM is called 2D-MCM at this time. 3D-MCM is a three-dimensional chip com...

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Problems solved by technology

[0006] The embodiment of the present invention provides an L-band down-conversion SIP module and its manufacturing method to solve the problems of traditional L-band down-conversion with various shapes, large volume and short service life

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