Manipulator and suction cup

A suction cup and conductive layer technology, applied in the directions of manipulators, manufacturing tools, chucks, etc., can solve the problems of ineffective release of thin wafers, weak antistatic ability of insulating materials, accumulation effect of electrostatic tips, etc. Round fragments, taking into account the effect of adsorption performance

Pending Publication Date: 2022-05-10
SEMICON MFG ELECTRONICS (SHAOXING) CORP
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the front body of the Bernoulli arm is made of metal materials, and the back body and stoppers are made of insulating materials. However, the insulating materials (such as fluororesin) have weak antistatic ability and are prone to electrostatic tip accumulation effec

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manipulator and suction cup
  • Manipulator and suction cup

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] In describing the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than Nothing indicating or implying that a referenced device or element must have a particular orientation, be constructed, and operate in a particular orientation should therefore not be construed as limiting the invention.

[0026] In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined. In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Lengthaaaaaaaaaa
Lengthaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to view more

Abstract

The manipulator comprises the suction cup, the suction cup is used for adsorbing a wafer based on the Bernoulli principle, the suction cup is provided with a first surface and a second surface which are opposite and comprises a metal suction cup body, and the first surface of the metal suction cup body is covered with an insulating layer and provided with a plurality of air holes. The suction cup further comprises a plurality of insulation check blocks distributed in the circumferential direction of the metal suction cup body, the insulation check blocks are used for limiting the periphery of the wafer, all the insulation check blocks are connected with the metal suction cup body through a conductive layer, and the conductive layer is used for making contact with the edge of the wafer. By means of the configuration, it can be ensured that the suction cup successfully releases the wafer after vacuum release, and the risk of wafer breakage is reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a manipulator and a suction cup. Background technique [0002] In the wafer processing process, the Bernoulli manipulator (suction cup) is a manipulator that utilizes the Bernoulli principle. The gas (such as inert gas such as nitrogen) ejected from the gas injection port of the manipulator meets the surface of the disc (such as the upper surface, Of course, it can also be the lower surface, take the above surface as an example), after the gas diffuses rapidly from the upper surface of the disk, the air velocity on the upper surface of the disk is greater than the air velocity on the lower surface. According to Bernoulli’s principle, at this time, The air pressure on the surface is greater than the air pressure on the upper surface of the disk, so that the disk is attracted to the Bernoulli manipulator. [0003] The Bernoulli manipulator absorbs the wafer through...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B25J15/06
CPCB25J15/0616
Inventor 张建康周立超曹乐杨红涛
Owner SEMICON MFG ELECTRONICS (SHAOXING) CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap