A heat dissipation structure of pin-fin base plate of igbt module

Abstract

The invention provides a heat dissipation structure for a pin-fin base plate of an IGBT module, which relates to the technical field of power electronic chip manufacturing and packaging and testing, and includes a main body substrate, the upper surface of the main body substrate is welded and connected with a DBC board, and the upper surface of the DBC board is connected The IGBT chip and the FRD chip are respectively installed, the ventilation component is welded and installed on the lower surface of the main body substrate, the lower end of the ventilation component is arranged on the upper surface of the interlayer substrate, and the ventilation component is arranged between the interlayer substrate and the main body substrate. In the invention, the thermal fluid self-pressurization technology is adopted, and the staggered and perforated methods are used. The fluids are continuously superimposed to increase the flow rate and divert the flow. There will also be other fluids flowing in, so that the flow rate can be maintained, so that the present application can effectively solve the problems caused by IGBTs. The device stack structure is relatively complex and has many interfaces, which leads to an increase in thermal resistance, which leads to the problem of not being able to cool down in time, and the optimized setting of the pin-fin, compared with the straight fin in the prior art, the pin-fin in the present application has Better heat dissipation capacity.

Description

technical field [0001] The invention relates to the technical field of power electronic chip manufacturing, packaging and testing, and in particular, to a heat dissipation structure of a pin-fin base plate of an IGBT module. Background technique [0002] The development trend of automobile electrification, networking, and intelligence has led to a substantial increase in the demand for automotive power devices. In the field of new energy vehicles, the power device IGBT plays a central role, accounting for 52% of the cost of the motor controller, and is the "heart" of the automotive power system. With the rapid increase in the performance requirements of new energy vehicles in the market, automotive-grade power device IGBTs need to withstand higher voltages and larger currents, and the requirements for their stability and reliability are getting higher and higher. In the future, high density, high reliability, and better integrated heat dissipation are the future development...

AI Technical Summary

Problems solved by technology

[0007] Aiming at the deficiencies of the prior art, the present invention provides a pin-fin bottom plate heat dissipation structure of the IGBT module, which solves the problem that in the prior art, due to the relatively complex structure of the IGBT device and the large number of interfaces, the thermal resistance becomes larger, and rapid cooling cannot be achieved and the The problem of optimizing the effect of existing fins on heat dissipation

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