Manufacturing process of packaged LED (light-emitting diode) for illuminating lamp

Abstract

The invention discloses a packaging LED manufacturing process for an illuminating lamp. The packaging LED manufacturing process comprises the steps that a nitride fluorescent adhesive film is arranged on the light-emitting upper surface of a to-be-packaged LED chip; a micro heat pipe is adopted; sealing the micro heat pipe; metal electrodes are plated at the two ends of the micro heat pipe respectively; arranging a light blocking layer; performing curing; and packaging the LED chip to be packaged. According to the manufacturing process of the packaged LED, the characteristics that the micro heat pipe can be heated and the liquid working medium is easy to vaporize are utilized to realize cold and hot circulation and energy transfer, so that the effect of rapid heat dissipation is achieved; the light blocking layer is arranged so that light is not prone to leaking out from the side face of the fluorescent glue film, the fluorescent glue film of a nitride system can enable light emitting to be more stable, and finally the purposes of being good in light emitting effect and rapid in heat dissipation are achieved.

Description

technical field [0001] The invention relates to the technical field of LED lighting, in particular to a process for manufacturing a packaged LED used for an illuminating lamp. Background technique [0002] Light-emitting diode (LED) light source, as a new type of green lighting source, has been widely used in the world due to its characteristics of no pollution, long life, low loss, and so on. With the application and development of LEDs, people's requirements for the size of LEDs are getting smaller and smaller. In order to meet the requirements of reducing the size of LEDs, chip-scale package CSP (Chip Scale Package) and wafer-level package WLP have emerged. The current CSP LED mainly has two structures: one is five-sided light-emitting CSP LED, and the CSP LED’s The four sides and the top surface are light-emitting surfaces, and the bottom is provided with positive and negative electrodes. The other is a single-sided light-emitting CSP LED, which only has the top surfac...

AI Technical Summary

Problems solved by technology

The problem is that the existing LED light structure cannot block the light leaking from the side of the fluorescent film, so the effect of this LED light emitting light from one side is not good

[0003] In addition, due to the poor heat dissipation performance of the current general LED filament products, the light decay is particularly serious, resulting in the service life of the bulb lamp using LED filament is much shorter than other LED lamps

Now the most used is COG (Chip-on-glass) filament with low thermal conductivity, which is not conducive to heat dissipation

However, the use of a metal substrate as a filament holder is opaque, and it is difficult to achieve a uniform luminous effect throughout the circumference

[0004] Therefore, under the existing technical solutions, it is difficult to balance the two requirements of good luminous effect and rapid heat dissipation to be solved urgently.

Images