Anti-frosting universal heat flow meter sealing test conversion tool

Abstract

The invention relates to an anti-frosting universal heat flow meter sealing test conversion tool, which comprises a hard cylindrical shell, an adjustable hoop, soft funnel type temperature-resistant silica gel and a skirt tower-shaped concentric-square-shaped interface, and is characterized in that the soft funnel type temperature-resistant silica gel is used for wrapping an air outlet of a heat flow meter and is connected with the skirt tower-shaped concentric-square-shaped interface; the soft funnel-shaped temperature-resistant silica gel is sleeved into the hard cylindrical shell, and is adjusted to a proper position by using the adjustable hoop to be fastened and assembled; according to different sizes of test DUT boards, corresponding specifications of skirt-shaped tower-shaped concentric-square-shaped interfaces are selected, and the skirt-shaped tower-shaped concentric-square-shaped interfaces are connected with an air outlet of a heat flow meter and are gathered in a central space above a to-be-tested integrated circuit of the test DUT boards; the bottom skirt edge of the conversion tool is provided with a test machine. According to the invention, the quality risk of abnormal power supply current caused by repeated operation and connectivity of high and low temperature tests of the integrated circuit is reduced, and the scientific research and production efficiency is improved by more than 30%.

Description

technical field [0001] The invention relates to a general-purpose heat flow meter seal test conversion tool for anti-frost, which belongs to the technical field of electrical performance testing. Background technique [0002] The electrical performance test of integrated circuits is one of the key links in the reliability screening test, and the electrical performance test is divided into room temperature Test, low temperature (-55±3°C) test, high temperature (125±3°C) test, etc., referred to as "three-temperature test", the temperature is military temperature level. Among them, the normal temperature test is to place the integrated circuit directly on the test board to run the test program, while the traditional high and low temperature test is to place the integrated circuit in a temperature test box with a set temperature value, and place it for a certain period of time according to regulations, so that the tested The internal PN junction temperature of the integrated c...

AI Technical Summary

Problems solved by technology

[0005] The technical problem solved by the present invention is: to overcome the deficiencies of the prior art, to propose a general-purpose heat flow meter sealing test conversion tool for anti-frost, and to solve the problem of difficult control of manual operation time and Issues such as secondary damage to integrated circuits and insufficient effectiveness of integrated circuit case temperature have eliminated the phenomenon of "low temperature frosting and high temperature outgassing" during high and low temperature tests of integrated circuits, and reduced repetitive operations and connectivity problems caused by high and low temperature tests of integrated circuits. The quality risk of abnormal power supply current can improve the efficiency of scientific research and production by more than 30%

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