Optical module packaging structure

Abstract

The invention discloses an optical module packaging structure. The optical module packaging structure comprises a shell, and a circuit board, a first device and a daughter board which are packaged in the shell, wherein the shell comprises a first shell and a second shell, and the outer surface of the first shell is a main heat dissipation surface; the first device is electrically connected with the circuit board through the daughter board; the surface of the circuit board is provided with a first signal line, and the surface of the daughter board is provided with an extension section; the daughter board and the circuit board are partially overlapped and connected, and a first signal line on the circuit board extends to an extension section on the daughter board; the surface of the partially overlapped daughter board and the surface of the circuit board face opposite directions, and the first device is electrically connected with the extension section on the daughter board; the first device is provided with a heat dissipation surface which faces and is in heat conduction connection with the first shell. According to the invention, the daughter board is connected with the circuit board, so that on one hand, most devices can dissipate heat through the main heat dissipation surface, and the heat dissipation performance of the module is effectively improved; and on the other hand, the wiring space of the circuit board is improved, via hole wiring is reduced, and the high-frequency performance of the module is improved.

Description

technical field [0001] The present application relates to the technical field of optical communication, and in particular to an optical module packaging structure. Background technique [0002] Such as figure 1 with 2 As shown, the optical module generally includes a housing 10' and an optoelectronic component packaged in the housing 10'. An optoelectronic component generally includes a circuit board 20', a high-speed electrical chip 40', a control chip 30', an optoelectronic chip 50' and an optical element 60'. The shell 10' is generally divided into upper and lower shells: the first shell 11' and the second shell 12', and the first shell 11' is closer to the heat dissipation area of ​​the light cage, and the heat dissipation speed is faster, and its outer surface It is the main heat dissipation surface 111' of the casing 10'. The heat dissipation speed of the second housing 12' is relatively slow, and its outer surface is a secondary heat dissipation surface 121'. The...

AI Technical Summary

Problems solved by technology

However, with the increase of devices, chips with high power consumption are placed on the same side, which will greatly increase the complexity of wiring, requiring a large number of conductive vias 22', and in high-speed interconnection, conductive vias 22' are easy to route Degraded signal quality, reduced high frequency performance

Similarly, when the high-speed signal line 21' is on the side of the circuit board 20' close to the main heat dissipation surface 111' (first casing 11') of the housing 10', the side of the optoelectronic chip 50' that is wired needs to face the main heat dissipation surface 111' , can be electrically connected to the high-speed signal line 21' by bonding, so that the heat sink 70 needs to be arranged between the photoelectric chip 50' and the secondary heat dissipation surface 121' (second casing 12') of the housing 10', and the photoelectric chip The heat of 50' is conducted to the secondary heat dissipation surface 121', and the heat is dissipated from the secondary heat dissipation surface 121', so that the heat dissipation speed of the photoelectric chip 50' is relatively slow

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