Thermally conductive silicone grease composition

Abstract

The invention discloses a heat-conducting silicone grease composition, which is prepared from the following raw materials in parts by mass: 80 to 120 parts of vinyl-containing high-molecular-weight polysiloxane; 1-10 parts of a surface treating agent; 800 to 2400 parts of a heat conducting filler; 0.5 to 20 parts of a hydrogen-containing cross-linking agent; 0.2-5 parts of a polymerization inhibition capsule; 1-10 parts of a heat-resistant additive; 0.01 to 2 parts of a retarder; and 0.01-5 parts of a platinum catalyst. According to the heat-conducting silicone grease composition disclosed by the invention, the polymerization inhibition capsule is added and is matched with other raw materials, so that the heat-conducting silicone grease composition has the advantages of long-term high-temperature aging resistance and the like, the hardness and the surface viscosity are basically unchanged or slightly changed under the condition of long-term high-temperature aging, and the elongation is slightly changed and is kept at 100% or above; the problems that the colloid hardness is increased, the ductility is reduced and the surface viscosity is poor under long-term high-temperature aging of the existing heat-conducting silicone grease are solved.

Description

Technical field [0001] The present invention relates to the field of thermal conductive material technology, in particular to a thermally conductive silicone grease composition. Background [0002] With the development of electronic technology, the integration of heating components is getting higher and higher, the chip size is also getting larger and larger, the heat generation of high-power chips and the resulting deformation of the entire PCB board have a negative impact on the flatness of the interface, and if the thermal conductive material cannot be deformed, it will lead to local voiding and layering of the thermal interface. [0003] As a silicone grease for heat conduction and heat dissipation, the traditional non-crosslinked silicone grease is baked at a long time at high temperature (such as 150 °C high temperature aging 1000H), the exudation of polysiloxane, resulting in colloid drying, hard cracking is difficult to avoid, the surface thermal resistance rises sharply,...

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Problems solved by technology

[0003] As a silicone grease for heat conduction and heat dissipation, the traditional non-crosslinked silicone grease will The leakage of oxane will cause the colloid to dry out, harden and crack, and the surface thermal resistance will rise sharply. It is difficult for some high-power chips to continuously perform the heat transfer function and cannot meet the requirements of large deformation and low thermal resistance.

[0004] For the existing siloxane heat conduction composition, the surface viscosity of the colloid is adjusted by adding surface treated powder, so as to achieve long-lasting moistening of the heat transfer surface Wet capacity does not take into account the increase in hardness, decrease in elongation, and decrease in surface viscosity of the colloid under the long-term 150°C high-temperature aging condition, resulting in a decrease in contact thermal resistance and delamination between the colloid and the upper and lower surfaces.

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