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Camera module and camera module assembling method

A camera module and photosensitive component technology, applied in image communication, camera body, color TV parts, etc., can solve problems such as cracks, color filter damage, broken, etc., to reduce costs, improve efficiency, The effect of process reduction

Pending Publication Date: 2022-05-20
NINGBO SUNNY OPOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, limited by the development trend of miniaturization of camera modules, it is difficult to increase the thickness of the color filter. If the air pressure is not well controlled during the production and preparation process, the color filter is easily damaged (for example, cracks or even broken).

Method used

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  • Camera module and camera module assembling method
  • Camera module and camera module assembling method
  • Camera module and camera module assembling method

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Embodiment Construction

[0054] Hereinafter, exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. It should be understood that the present application is not limited by the exemplary embodiments described here.

[0055] Application overview

[0056] As mentioned above, if the air pressure is poorly controlled during the production and preparation of the camera module, the color filter is easily damaged (for example, cracked or even broken). The camera module has to go through multiple processes during its production process, among which the baking and curing process is closely related to air pressure control.

[0057] Those of ordinary skill in the art should understand that the camera module can be regarded as a rectangular structure with a hollow structure at its...

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Abstract

The invention discloses a camera module and an assembling method of the camera module. The camera module comprises a photosensitive component; a lens assembly including a lens carrier mounted on the photosensitive assembly and the optical lens supported in the lens carrier; the lens carrier comprises a photosensitive component and a lens component, the photosensitive component and the lens component are accommodated in the outer frame, and a preset gap communicated with the outside is formed between the outer frame and the lens carrier; the packaging part of the photosensitive component is provided with a gas escape channel which is concavely formed on the upper surface of the packaging part, a first port of the gas escape channel extends to and is communicated with the closed space, and a second port of the gas escape channel extends to the preset gap to be communicated with the preset gap; and the gas escape channel and the preset gap form a gas escape passage for communicating the closed space to the outside. Therefore, in the baking and curing process of the camera module, the internal and external air pressure balance of the camera module can be controlled, and the light filtering element is prevented from being damaged due to pressure unbalance.

Description

technical field [0001] The present application relates to the field of camera modules, in particular to camera modules and an assembly method thereof. Background technique [0002] The module assembly industry is a precision processing industry, and its product quality is related to many factors in its production and processing process. Failure to control any factor may seriously affect the quality of the module. For example, particle control in the production environment, here, Particles can be understood as dust or dirt in the production environment. If the particle control is not up to standard, it is very easy to cause black spots in the image of the camera module. This kind of defect is not allowed, and the module can only be scrapped or repaired. [0003] In addition to particles and other substances that will affect module assembly, there are other environmental factors that are difficult to observe, which will also affect module production to varying degrees, such a...

Claims

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Application Information

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IPC IPC(8): H04N5/225G03B17/12
CPCG03B17/12H04N23/50H04N23/55
Inventor 张琼杨银凯曾俊杰钱佳敏
Owner NINGBO SUNNY OPOTECH CO LTD
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