Electronic product shell manufacturing process
A technology of electronic products and manufacturing process, which is applied in the fields of electrical components, telephone communication, glass production, etc. It can solve the problems of glass stiffness and strength decline, achieve improved combination gap problems, good impact resistance, and small electronic signal interference Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
specific Embodiment approach 1
[0035] The manufacturing process of the electronic product casing, the present embodiment takes the manufacturing process of the back cover of the mobile phone as an example, including the following steps:
[0036] Step 1: Prepare the explosion-proof membrane, including:
[0037] (A) Process the basic explosion-proof film with OCA optical adhesive to obtain the required explosion-proof film, including:
[0038] (A1) UV drawing transfer printing on the basic explosion-proof film with OCA optical adhesive;
[0039] (A2) The non-OCA surface of the explosion-proof film obtained in A1 is placed on a UV wire drawing die covered with UV liquid, the roller is pressed evenly, and the texture on the UV die is transferred to the explosion-proof film;
[0040] (A3) the anti-explosion film obtained in A2 is subjected to UV light irradiation and cured to form a stable texture;
[0041] (B) electroplating the explosion-proof film after UV transfer printing in A to form a coating layer;
...
specific Embodiment approach 2
[0061] The main difference between the second embodiment and the first embodiment is:
[0062] (1) In this embodiment, in H, the explosion-proof film and the back cover of the mobile phone are laminated. According to actual needs, the back cover of the mobile phone can be heated or laminated at normal temperature.
[0063] (2) In this embodiment, in J, if the defoaming treatment is multi-stage, the multi-stage is four stages.
[0064] Specifically, the specific settings of the four-stage high-pressure deaerator include: stage 1, pressure 1600±200KPA, temperature 50±10°C, time 10min±5min; stage 2, pressure 1500±100KPA, temperature 45±10°C, time 8min ±3min; stage 3, pressure 1300±100KPA, temperature 35±10℃, time 8min±3min; stage 4, pressure 1000±100KPA, temperature 30±10℃, time 4min±2min.
[0065] (3) In this embodiment, after the J treatment, the adhesion between the back cover of the mobile phone and the explosion-proof film is 20N.
[0066] (4) In this embodiment, the posit...
specific Embodiment approach 3
[0067] The main differences between the third embodiment and the second embodiment are:
[0068] (1) In this embodiment, in H, the explosion-proof film and the back cover of the mobile phone are laminated, and in this embodiment, the back cover of the mobile phone is laminated under heating.
[0069] (2) In this embodiment, in J, the defoaming treatment is multi-stage, and the multi-stage is four stages.
[0070] Specifically, the specific settings of the four-stage high-pressure deaerator include: stage 1, pressure 1600±200KPA, temperature 50±10°C, time 10min±5min; stage 2, pressure 1500±100KPA, temperature 45±10°C, time 8min ±3min; stage 3, pressure 1300±100KPA, temperature 35±10℃, time 8min±3min; stage 4, pressure 1000±100KPA, temperature 30±10℃, time 4min±2min.
[0071] (3) In this embodiment, after the J treatment, the adhesion between the back cover of the mobile phone and the explosion-proof film is 15N.
PUM
| Property | Measurement | Unit |
|---|---|---|
| adhesivity | aaaaa | aaaaa |
| adhesivity | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More