Efficient vertical linear thin plate electroplating auxiliary device for PCB (Printed Circuit Board) and HDI (High Density Interconnection) boards

Abstract

The invention discloses a PCB and HDI board efficient vertical line thin plate electroplating auxiliary device which comprises an electroplating clamp and a thin plate body arranged on the electroplating clamp, mounting frames are arranged on the two sides of the bottom of the thin plate body, and a plurality of clamping mechanisms used for being connected with the bottom of the thin plate body are arranged between the two mounting frames. The clamping mechanism comprises two positioning blocks which are respectively arranged in the mounting frame, and a connecting pipe is arranged between the two positioning blocks, so that the efficient vertical line thin plate electroplating auxiliary device for the PCB and the HDI board is different from the prior art, the lower end of the thin plate body is fixed and connected into a whole through the clamping mechanism, the lower end of the thin plate body is ensured to be on the same straight line, and the electroplating efficiency of the thin plate body is improved. The bottom of the thin plate body is in contact with the V-shaped floating groove at the same time when the thin plate body descends to enter the electroplating cylinder, the bending resistance is enhanced, simultaneous electroplating of the multiple sets of thin plate bodies is achieved through the displacement adjusting mechanism, and meanwhile the distance between the thin plate bodies can be changed according to the use requirements of different thin plate bodies.

Description

technical field [0001] The invention relates to the technical field of PCB and HDI board electroplating devices, in particular to a high-efficiency vertical line thin plate electroplating auxiliary device for PCB and HDI boards. Background technique [0002] Electroplating is the process of using the principle of electrolysis to coat a thin layer of other metals or alloys on the surface of certain metals. Such as rust), improve wear resistance, electrical conductivity, reflectivity, corrosion resistance and enhance aesthetics, etc. During electroplating, the electroplating fixture and the plated part will vibrate at the same time by applying resonance force to increase the uniformity of electroplating and remove air bubbles the goal of. [0003] With the development of electronic terminal products in the direction of lightness, smallness and precision, the circuit board is also designed thinner and the circuit is more refined, which makes the product more difficult to elect...

AI Technical Summary

Problems solved by technology

[0003] With the development of electronic terminal products in the direction of lightness, smallness and precision, the circuit board is also designed to be thinner and the circuit is more delicate, which makes it more difficult to electroplate the product. However, due to the thinner board during electroplating, its rigidity During the electroplating process, when the whole flying target board descends into the electroplating tank, the board will shake irregularly, and the board will be out of sync with the "V"-shaped floating tank, and the "V"-shaped floating tank floating on the liquid surface will be pressed down. During the groove, the first contact part bears a large force. During this process, the board will bend, and during the electroplating process, it will remain in a bent state, resulting in unequal distances between the board and the electrodes, forming obvious high and low current areas, and eventually causing the board to Because the copper thickness of the curved protruding part is thicker near the electrode, on the contrary, the copper thickness is thinner, resulting in uneven copper thickness, resulting in a large number of rework and scrapping, which seriously affects the efficiency and delivery time. Therefore, we propose a PCB and HDI plate high-efficiency vertical line thin plate plating auxiliary device

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