Laser beam combining device, laser beam combining method, photoacoustic measuring device and photoacoustic measuring method

A technology of laser beam combining and photoacoustic measurement, which is applied in the field of optical measurement, can solve the problems of difficult operation and low adjustment accuracy, and achieve the effect of easy acquisition and high signal-to-noise ratio

Pending Publication Date: 2022-05-27
SHANGHAI PRECISION MEASUREMENT SEMICON TECH INC
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  • Claims
  • Application Information

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Problems solved by technology

In most cases, the mirror is adjusted by a manual knob, which is difficult to operate and the adjustment accuracy is not high

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  • Laser beam combining device, laser beam combining method, photoacoustic measuring device and photoacoustic measuring method
  • Laser beam combining device, laser beam combining method, photoacoustic measuring device and photoacoustic measuring method
  • Laser beam combining device, laser beam combining method, photoacoustic measuring device and photoacoustic measuring method

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Embodiment Construction

[0029] The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application. Wherein, in the description of the embodiments of the present application, the terms used in the following embodiments are only for the purpose of describing specific embodiments, and are not intended to be used as limitations of the present application. As used in the specification of this application and the appended claims, the singular expressions "a," "the," "above," "the" and "the" are intended to also include, for example, "an or Multiple" is the expression unless the context clearly dictates otherwise. It should also be understood that, in the following embodiments of the present application, "at least one" and "one or more" refer to one or more than two (including two). The term "and / or", used to describe the association relationship of related objects, indicates that there can ...

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Abstract

The invention provides a laser beam combining device, a laser beam combining method, a photoacoustic measuring device and a photoacoustic measuring method which are applied to the field of semiconductors. The laser beam combining device comprises a laser, a first beam splitting module, a reflecting module, a beam combining module, a light condensing module, an imaging module and a control module, the beam combining module combines the excitation light beam and the detection light beam; the control module controls the first regulator to regulate the position of the first reflecting mirror and / or controls the second regulator to regulate the position of the second reflecting mirror based on the mass center position of the exciting light spot and the mass center position of the detecting light spot; the distance between the mass center position of the excitation light spot and the mass center position of the detection light spot is smaller than or equal to a preset threshold value. According to the laser beam combining device, the laser beam combining method, the photoacoustic measuring device and the photoacoustic measuring method provided by the invention, the overlap ratio of the exciting light spot and the detecting light spot can be improved, so that the optical measuring requirement of calculating the film thickness is met.

Description

technical field [0001] The invention relates to the technical field of optical measurement, in particular to a laser beam combining device and a beam combining method, a photoacoustic measurement device and a measurement method applied in the semiconductor field. Background technique [0002] The acousto-optic measurement system is used to measure the thickness of metal films, dielectric films, etc. During the measurement process, it is necessary to ensure the coincidence of the spot of the excitation light beam and the spot of the probe light beam. The better the coincidence, the more accurate the resulting measurement of film thickness. [0003] The process of aligning the spot of the excitation light beam and the spot of the probe light beam is as follows: determine the laser beam, expand the laser beam through the beam expander group, and the expanded laser beam passes through the beam splitter into two. One is the probe light beam, and the other is the excitation light...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/06G01B17/02
CPCG01B11/06G01B17/02
Inventor 唐岳陈煜杰董诗浩
Owner SHANGHAI PRECISION MEASUREMENT SEMICON TECH INC
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