Electronic chip low-temperature testing device

A technology for low-temperature testing and electronic chips, which is applied in the direction of electronic circuit testing, measuring devices, components of electrical measuring instruments, etc. It can solve the problems of inability to accurately test electronic chips, unstable and rising cold plate temperature, and improve low-temperature detection. The effect of improving efficiency, reducing the loss of cooling capacity, and improving accuracy

Inactive Publication Date: 2022-05-27
爱克普传热技术(无锡)有限公司
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  • Description
  • Claims
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Problems solved by technology

[0004] Regarding the above-mentioned related technologies, the inventor believes that after the cold plate is taken out of the refrigerator, the temperature of the cold plate will gradually rise due to the influence of the room temperature, resulting in an unstable temperature of the cold plate and the inability to accurately test the electronic chip

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  • Electronic chip low-temperature testing device
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  • Electronic chip low-temperature testing device

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Embodiment Construction

[0041] The following is attached Figure 1-4 The application is described in further detail.

[0042] The embodiment of the present application discloses a low-temperature testing device for an electronic chip.

[0043] refer to figure 1 and figure 2 , the electronic chip low-temperature testing device includes an incubator 1, and the incubator 1 achieves the function of heat preservation by pasting an insulation layer on its inner wall. A liquid storage tank 2, a pump 3, a refrigerator 4, a fixed cold plate 5, and a movable cold plate 6 are installed in the insulation box 1, and the liquid storage tank 2 is used for storing cooling liquid.

[0044] refer to figure 1 and figure 2 , the insulated box 1 is fixedly connected with a support frame 11, the fixed cold plate 5 is horizontally arranged and fixed on the upper surface of the support frame 11, and the fixed cold plate 5 and the movable cold plate 6 are equipped with a cooling pipeline 7. The liquid inlet end of th...

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Abstract

The invention relates to the field of electronic chip testing, in particular to an electronic chip low-temperature testing device which comprises a heat preservation box, and a liquid storage box, a pump, a refrigerating machine, a fixed cold plate and a movable cold plate are arranged in the heat preservation box. Cooling liquid is stored in the liquid storage tank, a liquid inlet of the pump is communicated with the liquid storage tank, and cooling pipelines are arranged in the fixed cold plate and the movable cold plate. The liquid inlet end of the cooling pipeline of the movable cold plate is communicated with the liquid outlet end of the cooling pipeline of the fixed cold plate through a corrugated hose, and the liquid outlet end of the cooling pipeline of the movable cold plate is communicated with the liquid storage tank through a corrugated hose. A containing opening is formed in the top of the heat preservation box, and the movable cold plate can penetrate out of the heat preservation box from the containing opening. The electronic chip low-temperature test method has the effect of improving the accuracy of the electronic chip low-temperature test.

Description

technical field [0001] The invention relates to the field of electronic chip testing, in particular to a low-temperature testing device for electronic chips. Background technique [0002] Electronic chips are widely used in the field of industrial automatic control, so the quality of electronic chips is related to the smooth work of industrial production lines. The working environment of electronic chips is complex and diverse, and sometimes low temperature resistance is required. Therefore, before the electronic chips leave the factory, low temperature tests are required for the electronic chips. [0003] Usually, the low-temperature test method for electronic chips is to place the cold plate in a refrigeration cabinet for cooling, after cooling the cold plate to a specified temperature, then take the cold plate out of the refrigeration cabinet, and place the electronic chip on the cold plate, so as to Electronic chips undergo cryogenic testing. [0004] Regarding the abo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G01R1/02H05K7/20
CPCG01R31/2877G01R1/02H05K7/20
Inventor 黄晨红
Owner 爱克普传热技术(无锡)有限公司
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