Wafer-level chip packaging process

Abstract

The invention provides a wafer-level chip packaging process which comprises the following steps: pasting an integrated film on the back surface of a wafer through a wafer ring, the integrated film comprising a back adhesive film and a scribing film; film-permeable printing: performing laser printing on the back adhesive film through the scribing film; and high-pressure baking is conducted, and bubbles generated in the integrated membrane in the permeable membrane printing process are eliminated. The integrated film is directly attached to the wafer and the wafer ring, the wafer and the wafer ring form an integral structure through the integrated film, all machines after wafer grinding can automatically grab the wafer ring through a mechanical arm, contact with the wafer is not needed, the full-automatic operation problem of wafer-level packaging of ultrathin wafers and warped wafers is solved, the production efficiency is improved, and the production cost is reduced. Meanwhile, the hidden crack and fragment risks of the wafer-level ultrathin sheet and the warped sheet in the transportation process and the operation process are reduced; in addition, high-pressure baking is carried out, bubbles in the integrated film are discharged from a gap between the scribing film and the back adhesive film in a high-pressure state, and the bubbles are eliminated.

Description

technical field [0001] The invention relates to a chip, in particular to a wafer-level chip. Background technique [0002] Wafer-level packaging is different from the packaging method of mechanical processing. Almost all packaging process steps are completed in parallel in the form of wafers, and then cut into single components. As wafer-level packaging requires thinner packaging for products, the risk of product cracking and debris is greatly increased during product transportation and operation. [0003] Specifically, the packaging process of CSP products is: ball mounting (ball mounting → reflow → cleaning) → testing → grinding (filming → grinding → peeling) → adhesive (adhesive → baking) → printing → dicing ( Patching → baking → dicing) → sorting. [0004] It can be seen from the above process that after the wafer is ground to the specified thickness in the polishing machine, it needs to be transferred to the peeling machine, the adhesive machine, the printer, and the ...

AI Technical Summary

Problems solved by technology

With the thinning of the wafer, the warpage of the product is increasing, which has exceeded the automatic operation capability of advanced packaging grinding and peeling machines, adhesive machines, printers, dicing and placement machines, etc. The current ultra-thin It is difficult for the chip to be picked up by the mechanical arm without cracks or fragments, which makes it unable to adapt to fully automated operations. The product can only be manually placed on the equipment chassis for manual production

However, since the ultra-thin sheet itself has no other support, it is prone to product cracks and debris during manual transportation

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