Solder ball laser jetting device

A spraying device and solder ball technology, which is applied in the direction of tin feeding device, welding equipment, manufacturing tools, etc., can solve the problems of easy material jam, unsmooth conveying, and affecting the speed of solder ball spraying, so as to improve stability and speed , improve accuracy and speed, and improve work efficiency

Active Publication Date: 2022-05-31
DONGGUAN D-TEK TECH CO LTD
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the nozzles of laser solder ball welding equipment on the market have complex structures. During the transportation of solder balls, material jams are prone to occur, the transportation is not smooth, and the solder balls cannot be guaranteed to be sprayed one by one, which affects the speed of solder ball spraying. Not conducive to improving welding accuracy

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  • Solder ball laser jetting device
  • Solder ball laser jetting device
  • Solder ball laser jetting device

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Embodiment Construction

[0047] In order to further illustrate the technical means and functions adopted by the present invention to achieve the intended purpose, the specific implementation modes of the present invention will be described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0048] Please refer to Figure 1 to Figure 4 , an embodiment of the present invention provides a solder ball laser jetting device, including:

[0049] A jetting head 1 is formed with a longitudinal jetting channel 111, an oblique feeding channel 112 communicating with the longitudinal jetting channel 111, and a solder ball feeding channel 141 communicating with the oblique dropping channel 112 in its interior. , and a feeding channel 121 communicating with the solder ball feeding channel 141 is formed on the spraying head 1, and a nozzle 113 communicating with the longitudinal spraying channel 111 is provided on the spraying head 1; meanwhile, on the spraying head 1 The spray...

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Abstract

The invention discloses a solder ball laser jetting device which comprises a jetting head, a longitudinal jetting channel, an oblique blanking channel communicated with the longitudinal jetting channel and a solder ball feeding channel communicated with the oblique blanking channel are formed in the jetting head, and a solder ball feeding channel communicated with the oblique blanking channel is formed in the jetting head. A feeding channel communicated with the solder ball feeding channel is formed on the injection head, and a nozzle communicated with the longitudinal injection channel is arranged on the injection head; meanwhile, a tin ball blanking control mechanism is arranged on the injection head, and the tin ball blanking control mechanism corresponds to the communication position of the tin ball feeding channel and the inclined blanking channel; and the laser device is used for emitting laser into the longitudinal injection channel. According to the solder ball laser jetting device, the structure is simplified, the solder balls can be conveyed orderly, smoothly, stably and rapidly, one molten solder ball can be jetted outwards each time, and the precision and efficiency of jetting welding can be improved.

Description

technical field [0001] The invention relates to a welding device, in particular to a tin ball laser spraying device. Background technique [0002] Laser solder ball welding is a high-efficiency precision brazing welding method that uses a high-energy-density laser beam as a heat source to melt solder balls to precisely connect applicable products. Laser soldering is one of the important aspects of the application of electronic components (SMT) processing technology. Over the years, the laser industry has developed rapidly in the world. Laser solder ball welding devices and methods have been widely and successfully used in the precision welding of micro and small parts, making great contributions to the development of microelectronics and modern communication technology. [0003] At present, the nozzles of laser solder ball welding equipment on the market have complex structures. During the transportation of solder balls, material jams are prone to occur, the transportation ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/06B23K1/005
CPCB23K3/0623B23K1/0056B23K2101/36
Inventor 罗后勇吴朋
Owner DONGGUAN D-TEK TECH CO LTD
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