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Method and equipment for improving surface consistency of light-emitting module

A light-emitting module and consistent technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as uneven filling, improve heat resistance and electrical insulation, improve surface consistency, and ensure uniformity Effect

Pending Publication Date: 2022-05-31
广州市鸿利显示电子有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to solve the problem of uneven filling of black high-contrast materials on the substrate, the present invention provides a method and equipment for improving the surface consistency of light-emitting modules

Method used

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  • Method and equipment for improving surface consistency of light-emitting module
  • Method and equipment for improving surface consistency of light-emitting module
  • Method and equipment for improving surface consistency of light-emitting module

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Embodiment Construction

[0032] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0033] see figure 1 , for ease of understanding, the substrate 1 with a plurality of light emitting chips is described here. The substrate 1 provided with a plurality of light emitting chips includes the substrate 11 and the light emitting chips 12 and the gap formed on the substrate 11 between the light emitting chips 12 .

[0034] Please combine figure 1 and figure 2 , the first embodiment of the present invention provides a method for improving the surface consistency of a light-emitting module, including the following steps:

[0035] S1: providing a substrate 1 with a plur...

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Abstract

The invention relates to the technical field of LED packaging, in particular to a method and equipment for improving the surface consistency of a light-emitting module, and the method comprises the following steps: providing a substrate of which the surface is provided with a plurality of light-emitting chips at intervals, and forming a plurality of gaps among the light-emitting chips; forming dark fluid material liquid drops with certain viscosity in the gap, wherein the height of the liquid drops is lower than that of the light-emitting chip; rotating the substrate attached with the dark fluid droplets at a preset speed by taking the center of the substrate as an axis, so that the dark fluid is distributed in the gaps of the light-emitting chips; and drying the dark fluid to form a dark layer. The gap filling method and device provided by the invention solve the technical problem that the black high-contrast material is non-uniformly filled on the substrate.

Description

【Technical field】 [0001] The invention relates to the technical field of LED packaging, in particular to a method and equipment for improving the surface consistency of a light-emitting module. 【Background technique】 [0002] Nowadays, in the manufacture of LED chips, the requirements for high contrast on the substrate are getting higher and higher, so the requirements for filling black high-contrast materials on the substrate are getting higher and higher. In the current process, the black high-contrast material will be filled unevenly on the substrate, resulting in differences in contrast. 【Content of invention】 [0003] In order to solve the problem of uneven filling of black high-contrast materials on a substrate, the present invention provides a method and equipment for improving the surface consistency of a light-emitting module. [0004] In order to solve the above technical problems, the present invention provides the following technical solution: a method for imp...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/54H01L33/56
CPCH01L25/0753H01L33/54H01L33/56H01L2933/005
Inventor 马飞飞陈永铭桑建
Owner 广州市鸿利显示电子有限公司
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