Semiconductor device with heat dissipation function

Abstract

The invention discloses a semiconductor device with a heat dissipation function, and belongs to the technical field of semiconductor devices.The semiconductor device comprises a semiconductor device body, the front side face and the rear side face of the semiconductor device body are each provided with a set of wiring pins, the upper surface of the semiconductor device body is provided with a heat conduction assembly, and the heat conduction assembly is of an I-shaped design; and a heat discharge box is arranged above the heat conduction assembly. According to the semiconductor device, the heat conduction assembly, the heat extraction box and the heat conduction mechanism are arranged, the heat conduction rods are supported through the elastic pieces, the multiple heat conduction rods are made to be fully attached to the semiconductor device body, the heat conduction rods transmit heat into the heat conduction media in the heat extraction box, and after the heat conduction media absorb the heat, heat exchange treatment is conducted through the semiconductor chilling plate; the heat dissipation device is suitable for being used for semiconductor device bodies of different specifications, and the heat dissipation effect is still not affected even if a gap exists between a heat conduction plate of a plane design and the semiconductor device body.

Description

technical field [0001] The invention belongs to the technical field of semiconductor devices, in particular to a semiconductor device with a heat dissipation function. Background technique [0002] Semiconductor devices are electronic devices whose conductivity is between good conductors and insulators, and use the special electrical properties of semiconductor materials to complete specific functions. They can be used to generate, control, receive, transform, amplify signals and perform energy conversion. The material is silicon, germanium or gallium arsenide, which can be used as rectifiers, oscillators, light emitters, amplifiers, photometers, etc. In order to distinguish it from integrated circuits, it is sometimes called discrete devices. [0003] The basic structure of most two-terminal devices (ie crystal diodes) is a PN junction. Semiconductor devices usually use different semiconductor materials, different processes and geometric structures, and a wide variety of cr...

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Problems solved by technology

In order to overcome the above-mentioned defects of the prior art, the present invention provides a semiconductor device with heat dissipation function, which solves the problem that in the heat dissipation technology of semiconductor devices, heat dissipation can only be carried out by one-way heat conduction through the crystal-bonding material on the semiconductor device, and the heat dissipation The thermal performance is poor, and the chip works at high temperature for a long time, which reduces its life and performance stability; at the same time, due to the inevitable size difference of power semiconductor devices in production, when different power semiconductor devices are installed together on the heat dissipation structure At this time, some power semiconductor devices cannot be completely in contact with the heat dissipation mechanism, so there are gaps, which affect its heat dissipation performance.

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