Ceramic-based PCB (Printed Circuit Board) structure with embedded component and preparation process of ceramic-based PCB structure
A technology of ceramic substrate and PCB board, which is applied in the direction of printed circuits, electrical components, and circuit substrate materials connected with non-printed electrical components, which can solve the problems of difficult to meet the requirements of heat dissipation and not considering the overall heat dissipation of the PCB board. , to increase the integration effect, facilitate the development of miniaturization, and solve the needs of excessive number of components and heat dissipation
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[0031] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the preferred embodiments of the present invention will be described below in conjunction with specific examples, but it should be understood that the accompanying drawings are for illustrative purposes only, and cannot be interpreted as an explanation of this patent. Restrictions; In order to better illustrate this embodiment, some parts in the drawings will be omitted, enlarged or reduced, and do not represent the size of the actual product; for those skilled in the art, some known structures and their descriptions in the drawings may Omissions are understandable. The positional relationship described in the drawings is for illustrative purposes only, and should not be construed as a limitation on this patent.
[0032] A ceramic-based PCB board structure with embedded components, including a ceramic substrate 1, a buried groove 2 is opened in the middle o...
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