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Stress buffering packaging structure of MEMS device

A stress buffering and packaging structure technology, applied in microstructure technology, electric solid devices, semiconductor devices, etc., can solve the problems of low structural strength, low rigidity, not suitable for high overload applications, etc., to achieve high packaging stress and consistent improvement properties, reducing the effect of stress coupling

Pending Publication Date: 2022-06-24
SUZHOU R&D CENT OF NO 214 RES INST OF CHINA NORTH IND GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Although the above method can better isolate the stress, it also has the disadvantage of low structural strength or low rigidity, which is not suitable for high overload applications.

Method used

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  • Stress buffering packaging structure of MEMS device
  • Stress buffering packaging structure of MEMS device
  • Stress buffering packaging structure of MEMS device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A stress buffer package structure of a MEMS device, refer to Figure 1 to Figure 4 , which includes a package tube 1 and a MEMS chip 6, the package tube 1 is fixedly provided with a stress buffer pad 4 for carrying the MEMS chip 6, and an adhesive sheet is arranged between the stress buffer pad 4 and the MEMS chip 6; stress; The buffer plate 4 includes a substrate 41, and the end face of the substrate 41 opposite to the MEMS chip 6 is provided with at least two protrusions with different heights; the substrate 41 is matched with at least two protrusions with different heights, so that A three-dimensional pattern feature is formed on the front side of the stress buffer pad 4, which is used to fix the adhesive to a specific shape, which can not only realize the bonding and fixing of the MEMS chip, but also greatly reduce the stress between the MEMS chip and the package shell. It can provide sufficient bonding strength to the MEMS chip, and greatly improve the consistency ...

Embodiment 2

[0043] A stress buffer package structure of a MEMS device, refer to Figure 5 , on the basis of Embodiment 1, the difference between this embodiment and Embodiment 1 is that in this embodiment, a boss 42 and three bump circles 43 are provided on the substrate 41, and the boss 42 and the three bumps The circles 43 are respectively arranged at the four top corners of the substrate 41 , and the heights of the substrate 41 , the bosses 42 and the bumps 431 increase to form another three-dimensional graphic feature on the front surface of the stress buffer plate 4 .

Embodiment 3

[0045] A stress buffer package structure of a MEMS device, refer to Figure 1 to Figure 4 as well as Image 6 , Based on Embodiment 1, the difference between this embodiment and Embodiment 1 is that in this embodiment, the second adhesive for bonding the MEMS chip 6 does not use the whole surface bonding, and is bonded at multiple points. is five glue points, including the boss glue point 51 and the bump circle glue point 52; the position and shape of the five glue points are determined by the position and shape of the boss 42 and the bump circle 43, namely The area of ​​the boss glue point 51 is about the area of ​​the boss 42, the glue thickness is equal to the first height difference, the diameter of the bump ring glue point 52 is about the diameter of the bump circle 43, and the glue thickness is the first height difference and the The sum of the second height difference; compared with Example 1, the stress buffering or releasing effect can be improved.

[0046] refer to...

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Abstract

The invention discloses a stress buffering packaging structure of an MEMS device, and relates to the technical field of chip packaging. According to the technical scheme, the MEMS chip packaging structure is characterized by comprising a packaging tube shell and an MEMS chip, a stress buffering base plate used for bearing the MEMS chip is fixedly arranged in the packaging tube shell, and die bonding glue is arranged between the stress buffering base plate and the MEMS chip; the stress buffering base plate comprises a substrate, and at least two protruding parts with different heights are arranged on the end face, opposite to the MEMS chip, of the substrate. According to the invention, the three-dimensional graphic features are formed on the front surface of the stress buffer base plate, so that the bonding and fixation of the MEMS chip can be realized, the stress coupling between the MEMS chip and the packaging tube shell can be greatly reduced, enough chip bonding strength can be provided for the MEMS chip, and the consistency of the chip bonding glue and the stress of the chip bonding glue can be greatly improved.

Description

technical field [0001] The invention relates to the technical field of chip packaging, and more particularly, to a stress buffer packaging structure of a MEMS device. Background technique [0002] MEMS devices such as gyroscopes, accelerometers, resonators, etc. are very sensitive to mechanical stress, because the stress can change the stiffness and resonant frequency of the MEMS sensitive structure, resulting in undesired coupling between the sensitive structure and external stress or thermal stress Therefore, how to reduce the internal stress of the MEMS device itself and reduce the influence of the external stress on the MEMS device is the key to improving the performance of the MEMS device. [0003] The packaging stress mainly comes from the thermal stress caused by the mismatch of thermal expansion coefficient between the MEMS chip and the packaging material. The external stress mainly comes from the change of the stress state of the PCB carrier caused by the SMT of the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00B81B7/02
CPCB81B7/0048B81B7/02
Inventor 周铭黄艳辉凤瑞鞠莉娜
Owner SUZHOU R&D CENT OF NO 214 RES INST OF CHINA NORTH IND GRP
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