Substrate structure and electronic device

Abstract

The invention discloses a substrate structure and an electronic device. The substrate structure includes a substrate, a plurality of conductive wires, and a plurality of conductive members. The plurality of through holes penetrate through the plate body of the substrate, the plurality of first conductive gaskets are arranged on the first surface and are adjacent to the first openings of the through holes, and the plurality of second conductive gaskets are arranged on the second surface and are adjacent to the second openings of the through holes. The conductive wires are contained in the through holes, the first ends of the conductive wires are located in the first openings of the corresponding through holes, and the second ends of the conductive wires are located in the second openings of the corresponding through holes. The conductive pieces are arranged on the first face and the second face of the board body, the first end of each conductive wire is electrically connected with the corresponding first conductive gasket through one conductive piece, and the second end of each conductive wire is electrically connected with the corresponding second conductive gasket through one conductive piece. Wherein at least one part of each conductive wire does not directly contact the hole wall of each through hole.

Description

technical field [0001] The present invention relates to a substrate structure, in particular to a substrate structure and an electronic device including the substrate structure. Background technique [0002] In the manufacturing process of electronic devices, especially optoelectronic devices, when the circuit layer on the upper surface of the substrate and the circuit layer on the lower surface are to be electrically connected, the traditional method is to drill holes in the substrate first, and then use chemical plating. Plating) and / or electroplating process to form a conductive film in the hole, so that the conductive film in the hole is respectively connected with the circuit layers on the upper and lower surfaces, thereby achieving the purpose of electrically connecting the circuit layers on the upper and lower surfaces of the substrate. [0003] However, using the electroless plating or electroplating process to form the conductive film not only has complicated proces...

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Problems solved by technology

[0003] However, the method of forming a conductive film by electroless plating or electroplating process is not only complicated in process and high in cost, but also has the problem of environmental pollution of electroplating solution.

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