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Array type positioning method and device for microscopic morphology observation

A technology of microscopic topography and positioning device, applied in the field of scanning electron microscope systems, can solve the problems of inefficient identification and processing of causes, inability to effectively determine the observation area, etc., and achieve the effect of ensuring stability

Pending Publication Date: 2022-07-08
CHONGQING UNIV
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Problems solved by technology

[0005] The object of the present invention is to provide an array positioning method and device for microscopic morphology observation, in order to improve the imaging range of the scanning electron microscope, and the imaging positioning has a certain delay and hysteresis, which cannot be effectively observed during the observation process. Determination of its observation area, especially in the identification of the cause of the corrosion reaction is not efficient

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  • Array type positioning method and device for microscopic morphology observation
  • Array type positioning method and device for microscopic morphology observation
  • Array type positioning method and device for microscopic morphology observation

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[0039] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0040] refer to Figure 1 to Figure 3As shown, one embodiment of the present invention is an array positioning method for microscopic topography observation, and the above method is used for the positioning of scanning electron microscope in continuous observation, wherein, scanning electron microscope in continuous observation is commonly used in The research on metal corrosion is mainly used for the corrosion test of metal sample Q; since metal corrosion is generally caused by a combination of various reasons, its corrosion is divided into five categories according to categories, namely ...

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Abstract

The invention discloses an array positioning method and device for microscopic morphology observation, and the method comprises the steps: enabling detection equipment to make contact with a sample to obtain front positioning information, building a coordinate system through a computer-aided system, carrying out the front observation through a scanning electron microscope, and recording a coordinate region of the front observation; comparing the data difference of the positioning information through a computer-aided system, pushing the sample to move through detection equipment, and enabling the moved position to correspond to the position of the front positioning information; the device comprises a base, the upper end of the base is provided with a placing cavity, the periphery of the placing cavity is provided with a guide rail, a guide block is arranged in the guide rail, detection equipment is installed on the guide block, and the detection equipment is distributed on the base in a symmetrical quadrant mode, so that the wide imaging range of the scanning electron microscope is expected to be improved, and imaging positioning has certain delay and hysteresis. The observation area cannot be effectively determined in the observation process, and particularly, the identification processing on the occurrence reason of the corrosion reaction is not efficient.

Description

technical field [0001] The invention relates to a scanning electron microscope system, in particular to an array positioning method and device for microscopic topography observation. Background technique [0002] Scanning electron microscope is a kind of imaging equipment through the interaction of electrons and matter. Its working principle is mainly that when high-energy incident electrons bombard the surface of matter, the excited area will generate secondary electrons, backscattered electrons, characteristic x-rays and other signals. , based on these signals, information about various physical and chemical properties of the sample itself can be obtained, so as to obtain images such as morphology, composition, crystal structure, and electronic structure. When observing metal products, the backscattered electron and secondary electron signal imaging are mainly used to observe the surface morphology of the sample, that is, a very narrow electron beam is used to scan the sam...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N23/2251
CPCG01N23/2251G01N2223/426G01N2223/418
Inventor 周洋张斌
Owner CHONGQING UNIV