Suction chamber wall for semiconductor device
A technology of adsorption structure and vacuum conduit, applied in the direction of circuits, discharge tubes, electrical components, etc., can solve the problems of insufficient pre-coating technology
Pending Publication Date: 2022-07-08
LAM RES CORP
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Problems solved by technology
However, for processes with very long durations, pre-coating techniques may not be sufficient
Method used
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[0026]Although the following detailed description contains numerous specific details for purposes of explanation, those of ordinary skill in the art will understand that many variations and modifications of the following details are within the scope of the present disclosure. Accordingly, without loss of generality and without imposing limitations on the claims appended hereto, aspects of the disclosure described below are set forth.
[0027] In general, various embodiments of the present disclosure describe systems and methods for providing adsorption structures that can be integrated into the interior regions of chambers used to process substrates to remove debris from the chamber during substrate processing. Particles and other by-products produced in The portion of the wall in which the adsorption structure is integrated may be a portion of the chamber wall, or a portion of a liner defined within the chamber, or a portion of a plasma confinement structure defined within th...
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A sorption structure defined in a plasma processing chamber includes an inner layer having one or more heating elements to heat the sorption structure, an intermediate portion having a coolant flow delivery network, a coolant flow delivery network through which coolant circulates to cool the adsorption structure to a temperature that allows selective adsorption of by-products released in the processing chamber, and a vacuum flow network connected to a vacuum line to create a low pressure vacuum and remove by-products released from the adsorption structure. A lattice structure is defined on the intermediate portion, the lattice structure including a network of openings defined in the plurality of layers to increase the surface area to improve by-product adsorption. The inner portion is disposed adjacent the middle portion. An outer layer of the lattice structure faces an interior region of the chamber. The size of the openings in the lattice-structured layer gradually increases from the inner layer to the outer layer such that the outer layer provides a larger surface area for adsorption of by-products. The vacuum line is activated during the adsorption step to create a low pressure region in the lattice structure relative to the pressure in the chamber to adsorb by-products. The desorption step is performed with WAC / CWAC to reliably remove accumulated by-products from the adsorption wall.
Description
technical field [0001] The present embodiments relate to semiconductor substrate processing equipment tools, and more particularly to an equipment tool having adsorption chamber walls for controlling the adsorption and desorption of particles and other by-products released during substrate processing. Background technique [0002] In semiconductor processing systems such as plasma chambers, reactive gases are used to generate plasma to etch various microscopic features on the surface of a substrate. These reaction gases produce by-product particles, such as polymers. These by-products adhere to exposed surfaces, such as chamber walls or the inner walls of the liner. These by-products must be removed periodically to prevent the accumulated by-products from contaminating the substrate surface and adversely affecting process results. [0003] One way to clean the chamber walls is to open the chamber and manually clean the walls. Manual cleaning may vary from chamber to chamb...
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IPC IPC(8): H01J37/32
CPCH01J37/32477H01J37/32862H01J37/32871H01J37/32522B01D53/0446B01D2256/10H01J37/32568H01J37/32816H01J2237/002H01J2237/24585H01J2237/334B01D53/04B01D53/0407B01D53/0438B01D2259/40096
Inventor 侯赛因·萨迪吉理查德·A·戈茨乔
Owner LAM RES CORP