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Manufacturing method of semiconductor chip electrothermal test core rod

A manufacturing method and semiconductor technology, which is applied in the field of semiconductor chip electrothermal test core rod manufacturing, can solve problems such as inconvenient operation, wasting a lot of time, and unsafety

Pending Publication Date: 2022-07-15
温州海得利电气有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Before the packaged chip is tested, the packaged chip must be heated. The traditional heating method is to pass the air through the heating wire to form hot air, and then pass it into the packaged chip to heat the packaged chip. This method is easy to heat because of the direct heating wire. Leakage, unsafe, short service life, inconvenient operation, and a lot of time wasted in the preheating process, resulting in a long time-consuming preheating process for packaged semiconductor chips and reduced work efficiency

Method used

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  • Manufacturing method of semiconductor chip electrothermal test core rod
  • Manufacturing method of semiconductor chip electrothermal test core rod
  • Manufacturing method of semiconductor chip electrothermal test core rod

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] S1: Select a stainless steel hollow tube with a thickness of 0.5 mm and a length of 60 mm, seal one end by a welding process, and use a lathe to flang the other end to form the tube body 1. ,like figure 2 shown.

[0026] S2: Select a porcelain rod with a length of 12 mm, for example, the porcelain rod is a magnesium oxide rod, and wrap the heating alloy material 2 on the outside of the porcelain rod, such as CR20NI80, CR15NI60, CR30NI70, CR20NI35, CR20NI32, CR25NI20, 2CR25NI20, 1CR25NI20SI2, OCR32NI13, OCR17NI12MO2, OCR19AL3, OCR25AL5, ICR13AL4, OCR21AL4, OCR21AL6, OCR27AL7, OCR27AL7MO2,

[0027] S3: Insert 2 alloy wire materials into the two holes in the middle of the ceramic rod that has been wound with the heating alloy material, and connect the high temperature wire, such as: PFA copper high temperature wire, PFA nickel high temperature wire, PFA alloy high temperature wire, PTFE Copper high temperature wire, PTFE nickel high temperature wire, PTFE alloy high tem...

Embodiment 2

[0036] S1: Select a stainless steel plate with a thickness of 0.65 mm, punch it with punching equipment, and punch it into a hollow steel pipe with a seal at one end and a bell mouth at the other end. The steel pipe has a diameter of 5 mm, a length of 100 mm, and a bell mouth; image 3 shown.

[0037] S2: Choose a porcelain rod with a length of 15m, and wrap the heating alloy material on the outside.

[0038] S3: Select 106 high-temperature wire with insulating layer, and remove the insulating layer with a length of 35m.

[0039] S4: Insert the above-mentioned peeled high temperature wire into the two holes in the middle of the ceramic rod that has been wound with the heating alloy material.

[0040] S5: Put a magnesium oxide U-shaped porcelain bottom on the head of the porcelain rod that has been wound and inserted in the previous process.

[0041] S6: Then insert two sections of magnesia ceramic head on the high temperature wire.

[0042] S7: Sleeve the high temperature w...

Embodiment 3

[0049] S1: Select a stainless steel plate with a thickness of 0.65 mm, punch it with punching equipment, and punch it into a hollow steel pipe with one end sealed and the other smooth. The diameter of the steel pipe is 5 mm and the length is 100 mm, such as figure 1 shown.

[0050] S2: Select a porcelain rod with a length of 15 mm, and wrap the heating alloy material on the outside.

[0051] S3: Insert two metal wires into the above porcelain rod and fix it.

[0052] S4: Weld the high-temperature wire on the outer end of the above-mentioned metal wire that has been inserted into the porcelain rod.

[0053] S5: A protective sleeve is placed on the outside of the porcelain rod.

[0054] S6: Put a magnesium oxide U-shaped porcelain bottom on the head of the porcelain rod that has been wound and inserted in the previous process.

[0055] S7: Then insert two sections of magnesia ceramic head on the high temperature wire.

[0056] S8: Sleeve the high temperature wire end of the ...

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Abstract

The invention discloses a manufacturing method of a semiconductor chip electrothermal test core rod, which comprises the following steps: S1, manufacturing a tube; s2, winding a heating alloy material on the outer part of the ceramic rod; s3, inserting an alloy wire-shaped material into the middle of the ceramic rod wound with the heating alloy material, and connecting a high-temperature wire; s4, a heat transfer medium is made into hollow porcelain blocks in various shapes, and the porcelain rods wound with the wires are sleeved with the hollow porcelain blocks; s6, selectively sleeving the high-temperature wire end of the semi-finished product into a sealing rubber part; s7, the sleeved end of the semi-finished product is inserted into the pipe body; the alloy metal is used for heating, and the heat transfer medium is used for transferring heat, so that the accidents of deformation, embrittlement, fracture, electric leakage and explosion of the steel pipe caused by long-time use can be avoided. On the basis, the manufacturing technology of the semiconductor chip electric heating test core rod is simple in process, raw materials are easy to obtain, manufacturing is convenient, and the semiconductor chip electric heating test core rod has the advantages of being free of electric leakage, safe, long in service life, convenient to operate and high in heating speed and is mainly applied to semiconductor chip electric heating test core rods.

Description

technical field [0001] The invention relates to the technical field of semiconductor chip testing, in particular to a manufacturing method of a semiconductor chip electrothermal testing core rod. Background technique [0002] With the continuous development of packaged chip technology, the testing technology of packaged chips has also become an important technical key in the electronics industry to ensure production quality and speed up the production process. Generally, a packaged chip that has been packaged needs to be electrically tested at a preset high temperature to understand the stability of the packaged chip. Before the packaged chip is tested, the packaged chip must be heated. The traditional heating method is to pass the air through the heating wire to form hot air, and then pass it into the packaged chip to heat the packaged chip. This method is easy to heat due to the direct heating wire. Leakage, unsafe, short service life, very inconvenient to operate, and wa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/00
CPCB23P15/00
Inventor 高凡
Owner 温州海得利电气有限公司