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Wafer clamping device

A clamping device and wafer technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve the problems of poor compatibility of wafer clamping devices, and achieve good adaptability, easy adjustment, and shortened distances.

Pending Publication Date: 2022-07-15
BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defect of poor compatibility of the wafer clamping device in the prior art, so as to provide a wafer clamping device for realizing wafers of different sizes on the same equipment

Method used

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  • Wafer clamping device
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Examples

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Embodiment 1

[0037] combine Figure 1-Figure 3 As shown, the wafer clamping device provided in this embodiment includes: a base plate 1; at least two support columns 2, both of which are arranged on the upper surface of the base plate 1 and are suitable for supporting wafers; a plurality of sliders 3, based on the base plate 1. The center of a virtual circle in the plane is symmetrically distributed in the center. Each slider 3 is slidably installed on the base plate 1, and the sliding direction is consistent with the radial direction of the virtual circle. The slider 3 is connected with a radial direction that drives it along the virtual circle. The sliding first driving member 4, the first driving member 4 can continuously adjust the position of the sliding block 3 in the radial direction of the virtual circle; a plurality of clamping shafts 5 correspond to the sliding block 3 one by one, and are installed on the sliding block 3, The top side of the clamping shaft 5 is adapted to contact...

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Abstract

The invention relates to the technical field of wafer processing, in particular to a wafer clamping device. The invention provides a wafer clamping device. The wafer clamping device comprises a bottom plate; at least two support columns; each sliding block is installed on the bottom plate in a sliding mode, the sliding direction of each sliding block is consistent with the radial direction of the virtual circle, each sliding block is connected with a first driving part which drives the sliding block to slide in the radial direction of the virtual circle, and the first driving parts can continuously adjust the positions of the sliding blocks in the radial direction of the virtual circle; and the multiple clamping shafts are in one-to-one correspondence with the sliding blocks and installed on the sliding blocks, and the side faces of the top ends of the clamping shafts are suitable for making contact with the edge of the wafer. According to the wafer clamping mechanism, wafers of different sizes can be clamped, and compared with an existing wafer clamping mechanism, the size of a wrap angle between the wafer and the clamping shaft cannot be changed, and the situation that the wafer flies out in the rotating process, the wafer is damaged, and economic losses are caused is avoided.

Description

technical field [0001] The invention relates to the technical field of wafer processing, in particular to a wafer clamping device. Background technique [0002] Wafer refers to the silicon wafer used in the manufacture of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. In the current wafer processing and manufacturing industry, a wafer clamping device is an indispensable means of production in manufacturing. [0003] At present, the wafer clamping device generally uses two mounting plates driven by a cylinder to drive two sets of clamping shafts, and the two sets of clamping shafts are opened and closed along the direction of the cylinder to complete the clamping and unloading of the wafer. Because the inter-axis distance of each set of clamping axes is fixed, the size of the clamped wafer is also fixed. It is reasonable for each type of wafer clamping device to only target one size of wafer wrap angle. When clamping wafers o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687
CPCH01L21/68764H01L21/68721H01L21/68792
Inventor 吴尚东史霄王剑石启鹏尹影李婷
Owner BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD
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