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Pressure-sensitive adhesive sheet for protecting semiconductor element

A technology of pressure-sensitive adhesive sheets and pressure-sensitive adhesive layers, which is applied in the manufacture of semiconductor/solid-state devices, conductive adhesives, pressure-sensitive films/sheets, etc., and can solve problems such as migration and contamination of semiconductor components

Pending Publication Date: 2022-07-19
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a problem may occur that the halogen element from the antistatic agent in the pressure-sensitive adhesive layer of the sheet migrates to the surface of the semiconductor element
In addition, when a surfactant is used as an antistatic agent, the surfactant may segregate on the surface of the pressure-sensitive adhesive layer to contaminate the semiconductor element

Method used

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  • Pressure-sensitive adhesive sheet for protecting semiconductor element
  • Pressure-sensitive adhesive sheet for protecting semiconductor element
  • Pressure-sensitive adhesive sheet for protecting semiconductor element

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0081] 100 parts by weight of base polymer 1, crosslinking agent (manufactured by Nippon Polyurethane Industry Co., Ltd., product name: "CORONATE L") 4 parts by weight, light release agent (manufactured by DKS Co., Ltd., product name: "EPAN710") 2 parts by weight, and antistatic agent 1 (manufactured by Nippon Nyukazai Co., Ltd., product name: "AMINOIONAS100", halogen-free ionic liquid) 7 parts by weight were mixed to prepare a pressure-sensitive adhesive layer form a composition.

[0082] The obtained pressure-sensitive adhesive layer-forming composition was applied to a polyolefin substrate of a three-layer structure (polyolefin / polypropylene / polyolefin, thickness: 100 μm) so that the total thickness thereof after drying became 105 μm, and then dried . Thus, a pressure-sensitive adhesive sheet for semiconductor element protection was obtained.

Embodiment 2

[0084] A pressure-sensitive adhesive sheet for semiconductor element protection was obtained in the same manner as in Example 1 except that the content of the antistatic agent 1 was set to 10 parts by weight.

Embodiment 3

[0086] A pressure-sensitive adhesive sheet for semiconductor element protection was obtained in the same manner as in Example 1 except that the content of the antistatic agent 1 was set to 30 parts by weight.

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Abstract

Provided is a pressure-sensitive adhesive sheet for protecting a semiconductor element, which appropriately protects a semiconductor wafer without reducing the yield. The pressure-sensitive adhesive sheet for protecting a semiconductor element includes: a pressure-sensitive adhesive layer; and a substrate. The surface resistivity of the pressure-sensitive adhesive layer is 1.0 * 1011 Omega / square or less. After the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet for semiconductor element protection and the silicon wafer are bonded to each other, left to stand at 50 DEG C for 24 hours, and the pressure-sensitive adhesive sheet for semiconductor element protection is peeled off, the halogen element ratio with respect to the total element content of the surface of the silicon wafer bonded to the pressure-sensitive adhesive layer is 0.3 at% or less.

Description

technical field [0001] This application claims priority based on 35 U.S.C Section 119 from Japanese Patent Application No. 2021-005037 filed on Jan. 15, 2021, which is hereby incorporated by reference. [0002] The present invention relates to a pressure-sensitive adhesive sheet for protecting a semiconductor element, and more particularly, to a pressure-sensitive adhesive sheet for protecting a semiconductor element to be used when a singulated semiconductor element is conveyed to a mounting process. Background technique [0003] A semiconductor element is produced by subjecting a silicon wafer to a back grinding process and a dicing process. The semiconductor element that has undergone these steps is transported to the semiconductor element mounting step when the pressure-sensitive adhesive sheet for protecting a semiconductor element is transported along with the reduced workability. The semiconductor element conveyed along with the conveyance of the pressure-sensitive a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/38C09J7/29C09J133/08C09J9/02H01L21/683
CPCC09J7/385C09J7/29C09J133/066C09J9/02H01L21/6836C09J2301/122C09J2301/162C09J2301/302C09J2423/006C09J2423/106C09J2203/326C09J2301/314C08K5/0075C08L65/00C08L25/18C09J7/38C09J2301/408C09J2433/00C08K2201/001C08K5/19C09J2301/312H01L2221/68327C09J9/00C09J11/00C08L101/00C08K3/041C08K3/042C08G61/126C08K5/3445
Inventor 植野大树水野浩二田中俊平林美希
Owner NITTO DENKO CORP