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Metal ceramic tube shell packaging structure and manufacturing method thereof

A cermet, tube and shell packaging technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, semiconductor devices, etc., can solve problems such as cracking and bottom anti-curvature, so as to solve the problem of anti-curvature and improve heat dissipation efficiency , The effect of solving the problem of large-area ceramic cracking

Pending Publication Date: 2022-07-29
YANGZHOU GUOYANG ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Purpose of the invention: The purpose of the invention is to propose a metal-ceramic shell package structure, which can change the stress distribution problem caused by the mismatch of the thermal expansion coefficient of the material, improve the problem of the anti-arc of the bottom surface after high-temperature welding, and solve the problem of large-area ceramic cracking at the same time , reduce the thickness of the insulating ceramic substrate, improve heat dissipation efficiency

Method used

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  • Metal ceramic tube shell packaging structure and manufacturing method thereof
  • Metal ceramic tube shell packaging structure and manufacturing method thereof
  • Metal ceramic tube shell packaging structure and manufacturing method thereof

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Embodiment Construction

[0034] The technical solutions of the present invention will be further described below with reference to the accompanying drawings.

[0035] refer to figure 1 , according to the cermet package structure of the embodiment of the present invention, including the cermet outer frame 100 and the insulating ceramic substrate 200, the metal cermet outer frame is arranged above the insulating ceramic substrate 200, and the cermet outer frame 100 The bottom is fixedly connected to the insulating ceramic substrate 200 .

[0036] The material, thermal conductivity and thermal expansion coefficient of the main components of the power module packaged in the metal-ceramic case are shown in Table 1. Since the thermal expansion coefficient of the insulating ceramic substrate 200 is small, the thermal expansion coefficient of the outer frame 100 of the cermet shell is relatively large. After high temperature sintering, the traditional Figure 5 In the package structure shown, the insulating...

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Abstract

The invention discloses a metal ceramic tube shell packaging structure and a manufacturing method thereof, the packaging structure comprises a metal ceramic tube shell outer frame and an insulating ceramic substrate, the metal ceramic tube shell outer frame is arranged above the insulating ceramic substrate, and the bottom of the metal ceramic tube shell outer frame is fixedly connected with the insulating ceramic substrate. According to the power module adopting the packaging structure, the contraction force of the metal ceramic tube shell outer frame after high-temperature welding only acts on the upper portion of the insulating ceramic substrate, stress distribution caused by mismatching of thermal expansion coefficients is changed, a thinner insulating ceramic substrate can be used, and higher heat dissipation efficiency is achieved.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a metal-ceramic package structure and a manufacturing method thereof. Background technique [0002] Power electronics technology occupies a very important position in today's rapidly developing industrial field. As a representative of power electronics technology, power electronics power modules have been widely used in electric vehicles, photovoltaic power generation, wind power generation, industrial frequency conversion and other industries. [0003] With the increasing demand for power modules, higher requirements are also put forward for high temperature, high voltage, and high power density of power modules. However, at present, most semiconductor power modules are packaged in plastic packaging, which has poor resistance to salt spray corrosion and operating temperature. The range is small, and the overall quality and reliability are poor, so metal-ceramic packaging is increas...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/04H01L23/373H01L23/00H01L21/48H01L21/50
CPCH01L23/04H01L23/562H01L23/3736H01L23/3735H01L21/4807H01L21/4803H01L21/50
Inventor 郝凤斌
Owner YANGZHOU GUOYANG ELECTRONICS CO LTD