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Vapor deposition source for vacuum vapor deposition device

An evaporation source and vacuum technology, which is applied in the directions of vacuum evaporation coating, sputtering coating, ion implantation coating, etc., can solve the problems of complicated cost and increase of vacuum evaporation equipment.

Pending Publication Date: 2022-08-02
ULVAC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, a mechanism for turning the sheet-like substrate inside out and an additional conveying roller are required, which leads to the complexity and cost increase of the vacuum deposition device.

Method used

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  • Vapor deposition source for vacuum vapor deposition device
  • Vapor deposition source for vacuum vapor deposition device
  • Vapor deposition source for vacuum vapor deposition device

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] Hereinafter, the method of the present invention will be described with reference to the drawings, taking a case where the sheet-like base material Sw is used as a film-forming object, and the sheet-like base material Sw is moved in a vacuum atmosphere while film-forming on both sides of the sheet-like base material Sw is taken as an example. Embodiment of a vapor deposition source for a vacuum vapor deposition apparatus. Hereinafter, the rollers are installed in the vacuum chamber Vc in a posture in which the axis direction of the transport rollers coincides with the horizontal direction, the axis direction is the X axis direction, and the direction orthogonal to the X axis in the same horizontal plane is the Y axis The direction, the vertical direction perpendicular to the X-axis and the Y-axis is the Z-axis direction, and the directions such as up and down are shown in the installation attitude of the vacuum vapor deposition apparatus. figure 1 as the benchmark.

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Abstract

The present invention provides a vapor deposition source for a vacuum vapor deposition device, the vapor deposition source comprising: a main cylinder having a crucible section filled with a vapor deposition material; the auxiliary cylinder body is provided with a release opening; and a heating device capable of heating at least the vapor deposition material filled in the crucible part. The auxiliary cylinder changes the phase position of the release opening and is detachably installed on the main cylinder. The cover body is used for freely closing the upper surface opening of the crucible part in an opening and closing manner; the vapor deposition material in the crucible part is sublimated or vaporized by heating the vapor deposition material in the crucible part by a heating device in a state in which the upper surface opening of the crucible part is closed by a lid in a vacuum atmosphere, and when the lid is opened, the sublimated or vaporized vapor deposition material is transported to the sub-cylinder while maintaining the vapor pressure thereof, and is released from the release opening. The heating device is provided with a heating body arranged in the auxiliary cylinder body and further provided with a supporting piece which is installed in the vacuum chamber and supports the auxiliary cylinder body in a point contact mode.

Description

[0001] This application is a divisional application of invention patent application 202080003552.1. technical field [0002] The present invention relates to a vapor deposition source for a vacuum vapor deposition apparatus for vapor deposition of a film formation object in a vacuum chamber. Background technique [0003] For example, it is known that a sheet-like base material made of resin has deformability and good workability, so it is known to form a single or multiple layers of a predetermined metal film or oxide film on one or both sides of the base material in a vacuum atmosphere. A predetermined thin film such as an object film, etc., or subjected to etching or heat treatment, is used as an electronic component and an optical component. A vacuum processing apparatus for performing such a vacuum processing film-forming process is known in Patent Document 1, for example. It has a vacuum chamber capable of forming a vacuum atmosphere, and in the vacuum chamber is provi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/24
CPCC23C14/24C23C14/562C23C14/568C23C14/243C23C14/26C23C14/14C23C14/12
Inventor 斋藤修司
Owner ULVAC INC