In-situ multifunctional electroplating bath device and working method

Abstract

The invention provides an in-situ multifunctional electroplating bath device and a working method, and belongs to the field of electroplating bath equipment. The light source and the liquid level meter are arranged above the electroplating bath at the same time, the spectrograph is connected with the light source, the input end of the optical fiber coupler is connected with the light source and the spectrograph at the same time, the optical probe and the collection control unit are connected with the output end of the optical fiber coupler, and the collection control unit is connected with the liquid level meter, the spectrograph and the optical probe at the same time. When the device is adopted to work, the liquid level meter measures the liquid level of electroplating liquid contained in the electroplating bath, light emitted by the light source sequentially enters the optical fiber coupler and the optical probe and then enters the liquid level of the electroplating liquid to be transmitted and reflected, and the light of the transmitted part further penetrates through the electroplating liquid, then enters the surface of a plated part and is reflected again. And a spectrograph is adopted to collect various reflected light in different time periods, and electroplating liquid concentration information and plating thickness information are obtained. According to the device and the method, the thickness of the plated part can be monitored in situ, and the plated part is not damaged.

Description

technical field [0001] The invention belongs to the field of electroplating bath equipment, and more particularly relates to an in-situ multifunctional electroplating bath device and a working method, which can monitor and measure the thickness and quality of the electroplating layer in situ, and can also realize the concentration of the electroplating solution. Automatic measurement and automatic replenishment of plating bath to plating bath. Background technique [0002] One of the important parameters to characterize the electroplating quality of the plated parts is the thickness of the coating. In order to ensure better electroplating quality, it is necessary to monitor the coating in real time and adjust the concentration of the electroplating solution in time. The existing electroplating process is to control the electroplating solution by manual dosing, and the manual method has disadvantages such as large workload and inaccurate control of the dosage; the detection o...

AI Technical Summary

Problems solved by technology

[0004] Among them, the magnetic method can only detect magnetic materials or magnetic coatings, which has certain limitations on the plating; the metallographic method and the Coulomb method are both destructive methods, which will cause damage to the coating; the X-ray fluorescence method is non-destructive, but the cost is high

In addition, the above method cannot detect in real time, so the thickness of the coating cannot be precisely controlled

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