Composition for forming polyimide film, method for preparing the composition, and use of the composition
A technology of polyimide film and composition, applied in the direction of chemical instruments and methods, applications, household appliances, etc., can solve the problems of increased yellowness index, decreased adhesion of substrates such as glass, etc., to achieve improved reliability, excellent optical Excellent physical properties and bending properties
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[0108] In the method for producing a polyimide film according to an embodiment, after the composition for forming a polyimide film is coated on the substrate, a placing step of placing at normal temperature may be further included. Through the placing step, the optical physical properties of the film surface can be more stably maintained. While not being bound by a particular theory, when the existing composition for forming a polyimide film is subjected to the above-mentioned placing step before curing, the solvent absorbs moisture in the air, and the moisture diffuses into the interior and interacts with the Polyamic acid and / or polyimide collide, resulting in cloudiness on the film surface and caking, which may cause uneven coating (refer to Figure 7 and Figure 8 ). On the other hand, the composition for forming a polyimide film according to one embodiment of the present invention is free from cloudiness and agglomeration even if it is left in the air for a long time, a...
Embodiment 1
[0124] Preparation of compositions for forming polyimide films
[0125] 133.5 g of dimethylpropionamide (N,N-dimethylpropionamide, DMPA) was filled in a stirrer flowing with nitrogen gas flow, and then 39 g of 2,2'-bismuth was dissolved while maintaining the temperature of the reactor at 25°C. (Trifluoromethyl)benzidine (TFMB). At a temperature of 50°C, 50 g of ethylene glycol bis(trimellitate) (TMEG100) was added thereto, and the mixture was dissolved and stirred. After stirring for 6 hours, 133.5 g of toluene (Toluene) was added at 25°C, followed by stirring for 18 hours. After that, DMPA and / or toluene were added so that the solids content was 20% by weight and the content of toluene in the composition was 50% by weight relative to the total weight of DMPA and toluene (ie, DMPA:toluene=50% by weight : 50% by weight). The viscosities of the prepared polyimide film-forming compositions are shown in Table 2 below.
Embodiment 2 to Embodiment 7
[0127] Preparation of compositions for forming polyimide films
[0128] A polyimide film for forming a polyimide film was prepared by the same method as in Example 1, except that DMPA and / or toluene were added so that the content of toluene satisfies the T content in Table 1 below with respect to the total weight of DMPA and toluene. combination. The viscosities of the prepared polyimide film-forming compositions are shown in Table 2 below.
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