Cover plate and wafer etching clamp system

Abstract

The embodiment of the invention discloses a cover plate and a wafer etching clamp system. Wherein the cover plate comprises a metal frame and a pressing claw structure; the metal frame comprises a plurality of open holes, the shape of the open holes is the same as that of the wafer, and the size of the open holes is larger than that of the wafer; the pressing claw structure is installed on the edge of the opening and used for fixing the wafer. Wherein the pressing claw structure and the metal frame are made of different materials, and the difference value between the dielectric constant of the pressing claw structure and the dielectric constant of the wafer is smaller than a preset dielectric constant difference value. Through the scheme, the dielectric constant of the press claw structure is close to or the same as that of the wafer, the potentials of the contact areas of the wafer edge and the press claw structure in the etching process are basically the same, no obvious potential difference is generated, and the distortion of the wafer edge pattern caused by the angle deviation of an electric field is avoided; and the symmetry of the pattern on the etched patterned substrate and the flatness of the C surface are obviously improved.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of semiconductor processing, and in particular, to a cover plate and a wafer etching fixture system. Background technique [0002] The manufacture of patterned sapphire substrate (PSS) consists of two pattern transfers. The yellow light process forms a heterogeneous glue column on the surface of the sapphire flat wafer, and the etching process uses the heterogeneous glue column as a mask to remove the excess sapphire and form Homogeneous graphics. In the etching process, in order to take into account both the efficiency and the process, a fixture composed of a tray, a cover plate, a sealing ring and a screw is generally used, and a plurality of sapphire wafers covered with heterogeneous glue columns are loaded in the middle and sent to the etching process chamber for processing. Operation. [0003] In the large-scale manufacturing process of PSS, the following requirements are placed ...

AI Technical Summary

Problems solved by technology

The existing fixture system still has problems such as obvious distortion of the edge of the wafer, short service life of the fixture, and high cost during use.

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