Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Ceramic shell flip chip packaging laminated structure and assembling method

A ceramic shell and flip-chip technology, which is applied in the direction of semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problem of inability to realize multiple flip-chip stacked structures, flip-chip interconnection obstacles, and reduce the cost of chips. To improve the effect of interconnection, broaden the scope of use, and ensure the effect of stacked connections

Pending Publication Date: 2022-08-05
华天科技(南京)有限公司
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this structure cannot realize the stacked structure of multiple flip-chips, which makes the interconnection of multiple flip-chips difficult, and cannot play the role of interconnecting multiple flip-chips, and the traditional way of interconnecting multiple flip-chips takes up space. Large, and reduces the use effect of chip interconnection

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ceramic shell flip chip packaging laminated structure and assembling method
  • Ceramic shell flip chip packaging laminated structure and assembling method
  • Ceramic shell flip chip packaging laminated structure and assembling method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] like figure 1As shown, a ceramic shell 6 flip-chip 2 package stack structure of the present invention includes a substrate 1 and at least two ceramic shells 6, wherein the substrate 1 is disposed at the bottom of the ceramic shell flip-chip package stack structure of the present invention The upper surface of the base plate 1 is respectively provided with two ceramic shells 6, the ceramic shell 6 is a rectangular structure, wherein the center of one end face of the rectangular structure is provided with a through groove penetrating the horizontal direction, and the two ceramic shells 6 include a first ceramic shell. and the second ceramic shell, the structure and shape of the first ceramic shell and the second ceramic shell are the same, wherein, the first ceramic shell is arranged on the substrate 1 and is fixedly connected with the substrate 1, and the second ceramic shell is arranged on the first ceramic shell. The upper surface of the ceramic shell is fixedly connec...

Embodiment 2

[0066] A method for assembling a ceramic shell flip-chip package stack structure, such as Figure 15 shown, including:

[0067] S1: set metal circuit connection points on the upper and lower surfaces of the substrate 1;

[0068] S2: The insulating layer body on the substrate 1 is arranged on the left and right sides of the upper surface of the substrate 1, and the metal bump 4 and the columnar metal 5 are arranged on the set insulating layer body;

[0069] S3: solder the solder balls 13 on the bottom surface of the flip chip 2 to the metal pads 10 on the upper surface of the substrate 1, and fill the protective colloid 3 between the lower surface of the chip and the upper surface of the substrate 1;

[0070] S4: set the first ceramic shell 6 above the insulating layer body on the set substrate 1;

[0071] S5: set metal pads 10 on the first ceramic shell 6, set the ceramic shell upper insulating layer 9, bump chips and metal bumps 4 on the set metal pads 10, set on the metal ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a ceramic shell flip chip packaging laminated structure and an assembling method, the ceramic shell flip chip packaging laminated structure comprises a flip chip, a ceramic shell and a substrate, the substrate is arranged at the bottom of the packaging laminated structure, and a plurality of solder balls are welded at the bottom of the substrate; the ceramic shells are arranged on the substrate, each ceramic shell is of a rectangular plate-shaped structure with a rectangular through groove formed in one side face, and the substrate and the ceramic shells form a laminated structure; the number of the flip chips is consistent with that of the ceramic shells, and the flip chips are fixedly arranged in the rectangular through grooves of the ceramic shells. According to the flip chip laminated structure, the flip chips, the ceramic shells and the substrate are arranged, the rectangular through grooves are formed in the bottoms of the ceramic shells, and the multiple ceramic shells are fixedly stacked on the substrate and the bottom ceramic shell, so that the flip chips can be arranged in a laminated mode, the interconnection use effect of the flip chips is improved, and the flip chips can be conveniently assembled and disassembled. And meanwhile, the use space for interconnection of the flip chips is reduced.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit chip packaging, and in particular relates to a ceramic shell flip-chip packaging laminated structure and an assembling method. Background technique [0002] For the following flip-chip bump chips, the chip bumps are interconnected with the pads on the substrate, and the outer ceramic shell is bonded to the substrate, which can protect the internal flip-chip, thereby forming a complete package body . However, this structure cannot realize the stacked structure of multiple flip-chips, so that the interconnection of multiple flip-chips has obstacles, and cannot play the role of multiple flip-chip interconnections, and the traditional method of multiple flip-chip interconnections takes up space. It is large and reduces the use effect of chip interconnection. SUMMARY OF THE INVENTION [0003] The purpose of the present invention is to provide a ceramic shell flip-chip package stack struc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/04H01L23/08H01L23/538H01L21/768
CPCH01L23/04H01L23/08H01L23/5386H01L21/76895
Inventor 汪民
Owner 华天科技(南京)有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com