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Dusting device for treatment of galss chip or chip

A technology for glass substrates and wafers, which can be used in photoplate-making process, optics, instruments, etc. on the patterned surface, and can solve the problems of expensive, complex internal structure and bulky volume of the ash removal chamber, etc.

Inactive Publication Date: 2004-08-04
DMS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0012] However, there is such a problem that the above-mentioned conventional ash removal device itself is complex, bulky and expensive
In particular, because the configuration of the ash removal chamber is limited due to the buffer chamber, it is necessary to ensure a relatively large working space, and the internal structure of the ash removal chamber is complicated, so that the production and cost of the device are at a disadvantage

Method used

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  • Dusting device for treatment of galss chip or chip
  • Dusting device for treatment of galss chip or chip
  • Dusting device for treatment of galss chip or chip

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Embodiment Construction

[0025] The present invention will now be described in detail with reference to the accompanying drawings.

[0026] In the following description, the production of wafers in semiconductor devices is considered to be the same thing as the production of glass substrates in liquid crystal displays, and thus, the ash removal apparatus for handling wafers will not be explained.

[0027] image 3 A dust removal device for a glass substrate of a liquid crystal display according to the present invention is schematically shown. Such as image 3 As shown, the ash removal device of the present invention has a vertically stacked structure. It is feasible to omit the buffer chamber in the traditional ash removal device. The upper ash chamber 100 and the lower ash chamber 101 are successively stacked in such a state that they are installed on a lift 300 for opening the upper ash chamber and the lower ash chamber. This structure is very advantageous for securing left and right work spaces...

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Abstract

A dusting device for treatment of glass chip or chip comprises a lower electrode on which the glass substrate or wafer applied with a photoresist is placed, an upper electrode forming an electric field together with the lower electrode, a gas slit or gas pipe to supply a gas into the chambers, a safety lid producing a sealed atmosphere together with an outside wall, a power supply device to form an electric field on the upper electrode and lower electrode, an insulator interposed between the upper electrode and the outside wall of the chamber to prevent electric contact, and an evacuation outlet to discharge photoresist evaporated in the chambers outside of the chambers.

Description

technical field [0001] The present invention relates to an apparatus for producing semiconductor devices, and in particular to an ash removal apparatus for processing glass substrates or wafers. Background technique [0002] On the surface of a wafer for producing semiconductor devices, or on the surface of a glass substrate for producing a liquid crystal display, a photo-resist material (photo-resist) is applied to form a pattern of a functional thin film, wherein the pattern of the film is formed by a developing method, and then remains on the The photoresist material on the surface of the wafer or glass substrate is removed by dedusting process. [0003] In recent years, a plasma deashing device is used, which irradiates plasma to etched portions of a photoresist material to calcify them, and vaporizes them to discharge the gas outside. If such a device is used, the cleaning process can be simplified without damaging and contaminating the untrea...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/1333G02F1/13H01L21/30H01L21/302H01L21/304H01L21/3065H01L21/84
CPCG03F7/427
Inventor 裵禹庆
Owner DMS CO LTD