Collecting device

Abstract

A collection device, which includes: an exhaust channel, used to evacuate the airtight sealed chamber by a vacuum pump; an airtight sealing collection container, extending through the exhaust channel and a regeneration channel adjacent to the exhaust channel; a collection A collector, located in the collection container to absorb the product in the discharged gas, and remove the product from the discharged gas, the collector is selectively located on the exhaust channel or the regeneration channel; a valve member, located on both sides of the collector , which can move integrally with the collector; a sealing member, which is installed on the outer peripheral surface of the valve member, so that the collector can slide on the inner peripheral surface of the collection container when it is moved.

Description

technical field [0001] The present invention relates to a collection device used in an evacuation system for evacuating a vacuum chamber of semiconductor manufacturing equipment or the like. Background technique [0002] Refer to the attached Figure 16 A commonly used evacuation system will be described. exist Figure 16 Here, a hermetically sealed chamber 201 includes a processing chamber used in a semiconductor manufacturing process, such as an etching device or a chemical vapor deposition (VCD) device. The hermetically sealed chamber 201 is connected to a vacuum pump 203 through an exhaust channel 202 . The vacuum pump 203 is used to increase the pressure of the gas exhausted from the hermetically sealed chamber 201 to atmospheric pressure during the exhaust process. Therefore, an oil-sealed rotary vacuum pump is used as the vacuum pump 203 . Currently, a dry pump is mainly used as the vacuum pump 203 . [0003] If the required vacuum degree of the hermetically seale...

AI Technical Summary

Problems solved by technology

However, it still has the problem that solid matter settles in the exhaust gas treatment equipment located downstream of the vacuum pump, thereby clogging a packing layer in the exhaust gas treatment equipment

However, in general, the collection efficiency of this commonly used collection device is not high, and about 60% of the exhaust components flow through the collection device without being adsorbed on the collector, but adsorbed on the downstream pipelines and equipment

This is mainly because the discharged gaseous state flows through the section with low collection efficiency between the inner wall of the container and the collector of the collection device, thus passing through the collection device without being collected

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