Repeatedly usable unpatterned wafer and forming method thereof

Abstract

This invention discloses a forming method for a unpatterned water of a semiconductor process. A basic material is provided first, then an oxidation layer is formed on it and a non-crystallosilicon layer is formed, after that an ion implantation process is carried out for doping the non-crystallosilicon layer and oxidation layer. Secondly, a temper process is taken to form a unpatterned wafer and Rs is tested after that and schedule monitor is done, the non-crystallosilicon layer and oxidation layer on the moisture control plate basic material and the unpatterned wafer can be used repeatedly to reduce schedule monitor cost.

Description

technical field [0001] The invention relates to a method for forming a wafer control sheet, in particular to a method for forming a reusable wafer control sheet. Background technique [0002] As the integration of semiconductor elements continues to expand, such as Metal-Oxide-Semiconductor (MOS) elements, in order to keep the area of ​​the chip (chip) the same, or even shrink it, in order to continuously reduce the unit cost of the circuit, the only The method is to continuously reduce the circuit design rules to meet the future development trend of the high-tech industry. Therefore, the space occupied by components is also gradually reduced with the circuit design rules. With the development of semiconductor technology, the dimensions of components of integrated circuits have been reduced to the deep sub-micron range. As semiconductors continue to shrink down to the deep sub-micron range, some problems arise in process scaling. A very large scale integrated circuit (VLSI...

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Problems solved by technology

[0004] However, the cost of the traditional wafer control wafer is not low for the semiconductor manufacturing process because the process maker of the traditional wafer control wafer can only be used once.

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