Protective cover against acid and alkali corrosion and using method thereof

Abstract

The invention discloses a protection cover capable of protecting a single-face pattern of a silicon wafer from being influenced by wet etching and an application method thereof. The protection cover adopts a top plate and a bottom plate to clamp a chip which needs pattern protection in the middle, and the top plate is in sealed connection with the bottom plate through a fastening screw; rubber rings are respectively placed between the top plate and the chip and between the bottom plate and the chip, and sealing is achieved through compressive deformation of the rubber rings; a round through hole is arranged in the center of the bottom plate, and corrosive liquid corrodes the back of the chip through the through hole; a round groove is arranged in the center of a sealed upper cover board, and water is injected into the groove to prevent the corrosive liquid from seeping into the inner sides of the rubber rings to directly corrode the silicon wafer. One face of the chip, which needs protection, is soaked into other liquid by the protection cover, so that damage from wet etching is avoided. The whole structure is easy to assemble and disassemble, simple and convenient to use, and through replacing the sealing rings, the protection cover can be repeatedly used.

Description

technical field [0001] The invention relates to a protective cover used to protect one side of the chip from being corroded by high temperature, concentrated acid or concentrated alkali liquid in the process of wet etching and its application method, especially in silicon-based MEMS devices, silicon The invention discloses a protective cover for protecting a double-sided polished silicon wafer and a single-sided pattern of a double-sided polished SOI wafer during the process of a MOEMS-based device, and a method of use thereof. technical background [0002] Wet etching is a common process link in the process of semiconductor device processing. The corrosive liquid is mostly corrosive strong acid and strong alkali. Under a certain pressure and a certain temperature, the required graphics are prepared by simple chemical reactions. . [0003] In the manufacturing process of silicon-based MEMS and MOEMS devices, such as accelerometers, cantilever beams, pressure sensors, etc., ...

AI Technical Summary

Problems solved by technology

At this time, if one side of the silicon wafer has silicon exposed after dry etching and other processes, and then wet etches the pattern on the other side, the exposed part of the silicon on the front side will also be etched away, thereby destroying the overall device structure.

Images