Protective cover against acid and alkali corrosion and using method thereof

A technology of protective cover and alkali corrosion, which is applied in the process of producing decorative surface effects, decorative art, gaseous chemical plating, etc., can solve the problem of destroying the structure of the device, and achieve the advantages of convenient use, simple structure, and easy disassembly Effect

Inactive Publication Date: 2016-08-24
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, if one side of the silicon wafer has silicon exposed after dry etching and other processes, and then wet etches the pattern on the other side, the exposed part of the silicon on the front side will also be etched away, thereby destroying the overall device structure.

Method used

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  • Protective cover against acid and alkali corrosion and using method thereof
  • Protective cover against acid and alkali corrosion and using method thereof

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Experimental program
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Effect test

Embodiment Construction

[0013] 1. Introduction to the structure of the protective cover

[0014] The protective cover designed by the present invention is mainly composed of the following parts: 1, top plate, 2, bottom plate, 3, transfer post, 4, handle, 5, fastening screw, 6, glass tube, 7, O-shaped rubber ring , 8, chip.

[0015] Refer to the attached figure 1 , 2 The function of each component is described in detail:

[0016] 1 in the figure is the top plate of the protective cover, and the material is made of materials that can withstand high temperature, strong acid resistance, and strong alkali resistance; there is a boss at the center of the front, and there is a through hole with a larger diameter with internal thread on the boss, which is consistent with 3 The external thread at one end matches, and there is a groove under the through hole, which is matched with 703, and there is a through hole with a smaller diameter downward; 1 Six (not limited to six) through holes are evenly distribut...

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Abstract

The invention discloses a protection cover capable of protecting a single-face pattern of a silicon wafer from being influenced by wet etching and an application method thereof. The protection cover adopts a top plate and a bottom plate to clamp a chip which needs pattern protection in the middle, and the top plate is in sealed connection with the bottom plate through a fastening screw; rubber rings are respectively placed between the top plate and the chip and between the bottom plate and the chip, and sealing is achieved through compressive deformation of the rubber rings; a round through hole is arranged in the center of the bottom plate, and corrosive liquid corrodes the back of the chip through the through hole; a round groove is arranged in the center of a sealed upper cover board, and water is injected into the groove to prevent the corrosive liquid from seeping into the inner sides of the rubber rings to directly corrode the silicon wafer. One face of the chip, which needs protection, is soaked into other liquid by the protection cover, so that damage from wet etching is avoided. The whole structure is easy to assemble and disassemble, simple and convenient to use, and through replacing the sealing rings, the protection cover can be repeatedly used.

Description

technical field [0001] The invention relates to a protective cover used to protect one side of the chip from being corroded by high temperature, concentrated acid or concentrated alkali liquid in the process of wet etching and its application method, especially in silicon-based MEMS devices, silicon The invention discloses a protective cover for protecting a double-sided polished silicon wafer and a single-sided pattern of a double-sided polished SOI wafer during the process of a MOEMS-based device, and a method of use thereof. technical background [0002] Wet etching is a common process link in the process of semiconductor device processing. The corrosive liquid is mostly corrosive strong acid and strong alkali. Under a certain pressure and a certain temperature, the required graphics are prepared by simple chemical reactions. . [0003] In the manufacturing process of silicon-based MEMS and MOEMS devices, such as accelerometers, cantilever beams, pressure sensors, etc., ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C1/00H01L21/67
Inventor 柳瑞丛刘媛媛
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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