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95results about How to "Achieve repeated use" patented technology

Ozone catalytic oxidation method and device

The invention discloses an ozone catalytic oxidation method and device. The device comprises a contact oxidation tank, a water input pipe, a booster pump, a high-efficiency dissolved-air ejector, a perforated pipe water distributor, a catalyst filling material separation plate, a catalyst filling material, an ozone air inlet pipe, an ozone tail gas air inlet pipe and an ozone tail gas destroying device. The contact oxidation tank has a multi-section shunting type, sewage flows into the contact oxidation tank from the bottom and flows out from the top, and an up-flow contact oxidation reaction route is formed. Ozone is fully mixed with sewage and dissolved through the high-efficiency dissolved-air ejector, and is distributed at the bottom of the reaction tank through the perforated pipe water distributor. The catalyst filling material separation plate is arranged at the bottom of the reaction tank, and a catalyst layer is arranged on the separation plate. The catalyst is a high-efficiency load-type catalyst with metal and metal oxide loaded on a porous carrier. Sewage and ozone are subjected to a heterogeneous catalysis reaction in the contact oxidation tank under catalysis of the load catalyst, the ozone utilization efficiency and the oxidation efficiency are raised greatly, the ozone addition amount is reduced, and the operation cost is lowered.
Owner:GO HIGHER ENVIRONMENT GRP CO LTD

Water-cooled gas laser tube

The invention relates to a gas laser tube. A water-cooled gas laser tube comprises a discharge tube, a cathode electrode, an anode electrode, a reflecting mirror, an output mirror, a metal supporting frame, an insulated anode electrode chamber and a cathode electrode chamber. The anode electrode chamber is connected at one end of the metal supporting frame, and the cathode electrode chamber is connected at the other end of the metal supporting frame. The metal supporting frame is provided with a cooling chamber and a gas storage chamber. The cooling chamber extends in the extension direction of the discharge tube, and the gas storage chamber is communicated with both the anode electrode chamber and the cathode electrode chamber. The discharge tube penetrates through the cooling chamber and communicates the anode electrode chamber with the cathode electrode chamber together , the two ends of the discharge tube are connected with the cooling chamber in a sealing mode, a water inlet is formed at one end of the cooling chamber, a water outlet is formed at the other end of the cooling chamber, the reflecting mirror and the anode electrode are located in the anode electrode chamber, the output mirror and the cathode electrode are located in the cathode electrode chamber. The water-cooled gas laser tube can be conveniently recycled and reused and solves the problems that an existing laser tube of a glass structure can be easily broken to caused losses to clients, is inconveniently to recycle and reuse and a large amount of harmful gas can be generated in the process of production.
Owner:HANGZHOU XINTOU TECH

Fabricated multi-arch wall foundation pit supporting structure and construction technology

The invention discloses a fabricated multi-arch wall foundation pit supporting structure and a construction technology, and belongs to the field of geotechnical engineering. The fabricated multi-archwall foundation pit supporting structure comprises precast concrete arch pieces and steel piles in the special shape like the Chinese character 'shan'. Arc-shaped steel with the H-shaped cross section, and each precast concrete arch piece are vertically combined together through casting, and the two arc pieces can be in butt joint at grooves of the arc-shaped steel in the vertical direction and connected at reserved holes through bolts. The cross section of each special-shaped pile shaped like the Chinese character 'shan', oblong reserved holes are formed in the flange of each steel pile at intervals and communicate with reserved holes in a corresponding arc piece connection rib, the oblong reserved holes in the steel piles can be connected with the reserved holes in the arc piece connection ribs through bolts, and reserved anchor rod holes can be formed in special-shaped pile webs. If a foundation pit is shallow, the special-shaped piles and the reinforced concrete precast arc piecesare subjected to combination construction, thus, a complete and closed cantilever pile foundation pit supporting system can be formed, no support or cat anchor need to be arranged, and if the foundation pit is deep, a cat anchor or an inner support can be additionally arranged.
Owner:NANJING UNIV OF TECH

Gas hydrate method sewage treatment system

The invention relates to a gas hydrate method sewage treatment system belonging to the field of environmental science and engineering. The gas hydrate method sewage treatment system comprises two levels of treatment facilities and comprises a first-level treatment water mixture-sewage transportation unit, a first-level treatment hydrate generation decomposing unit, a secondary-level treatment water mixture-sewage transportation unit and a secondary-level hydrate generation decomposing unit. Hydrate decomposition water after first-level treatment is used as a raw material of secondary-level treatment, and pollutant removal efficiency is improved through two-level treatment. The gas hydrate method sewage treatment system is suitable for large-scale treatment of domestic wastewater and industrial wastewater, inorganic pollutant and organic pollutant can be effectively removed simultaneously, operating cost is reduced due to cyclic utilization of water mixture, heat and mass transfer of hydrate generation process is strengthened due to arrangement of a spray device and a stirrer, and the hydrate growth velocity is increased. The system and the method are reasonable and compact in structure, industrial production requirement is met, operation process is stable and reliable, cost is low, energy is saved and environment is protected.
Owner:DALIAN UNIV OF TECH

Heavy rare earth metal target material repairing method

The invention provides a heavy rare earth metal target material repairing method and belongs to the technical field of magnetron sputtering surface treatment. The heavy rare earth metal target material repairing method comprises the following steps: filling the loss area of a to-be-repaired target material with alloy powder, and performing the repairing operation by adopting a vacuum sintering method or a high-pressure cold spraying method, wherein the alloy powder comprises a dysprosium-terbium alloy or one or two of dysprosium and terbium and one or two of metalloids. The heavy rare earth metal target material repairing method provided by the invention has the beneficial effects that the alloy powder is adopted as a repairing material; the repairing operation is performed by adopting thevacuum sintering method or the high-pressure cold spraying method; the alloy powder plays a role in brazing, and thus the sintering temperature during the follow-up target material repairing operation is reduced; furthermore, the diffusion temperature after the film coating operation on a magnetic sheet is reduced, and the repairing difficulty and cost are reduced; according to the structure of the target material repaired through the heavy rare earth metal target material repairing method, the problem that the existing target surface cannot be reused after being defective is effectively solved; and the process is simple, the cycle is short, the use effect is close to a new target material, and the application value is good.
Owner:BAOTOU JINSHAN MAGNETIC MATERIAL

Acid and alkali corrosion resistant protection cover and application method thereof

The invention discloses a protection cover capable of protecting a single-face pattern of a silicon wafer from being influenced by wet etching and an application method thereof. The protection cover adopts a top plate and a bottom plate to clamp a chip which needs pattern protection in the middle, and the top plate is in sealed connection with the bottom plate through a fastening screw; rubber rings are respectively placed between the top plate and the chip and between the bottom plate and the chip, and sealing is achieved through compressive deformation of the rubber rings; a round through hole is arranged in the center of the bottom plate, and corrosive liquid corrodes the back of the chip through the through hole; a round groove is arranged in the center of a sealed upper cover board, and water is injected into the groove to prevent the corrosive liquid from seeping into the inner sides of the rubber rings to directly corrode the silicon wafer. One face of the chip, which needs protection, is soaked into other liquid by the protection cover, so that damage from wet etching is avoided. The whole structure is easy to assemble and disassemble, simple and convenient to use, and through replacing the sealing rings, the protection cover can be repeatedly used.
Owner:INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI

Metal spray marking plate special for cold and hot rolling

The invention relates to a metal spray marking plate special for cold and hot rolling. The metal spray marking plate special for the cold and hot rolling comprises a number plate engraved with numbers, base plates and chain shaft components used for connecting adjacent base plates. Each base plate is a frame shaped like a Chinese character 'ri'. Reverse T-shaped through grooves and inner grooves oppositely formed inwards are formed in the two sides of each frame. Two sides of the number plate is inserted in two groove openings of the base plate. The chain shaft components comprise a double-row connecting shaft, groove seats and a mandril. The double-row connecting shaft is provided with a connecting portion. The middle segment of the mandril penetrates through the double-row connecting shaft. Two ends of the mandril are respectively penetrate through circular holes of the groove seats. An end head of the mandril is riveted on one groove seat. The groove seats are arranged in the reverse T-shaped through grooves of the base plate. The shape of the lower portion of each groove seat is matched with that of each through groove. The groove seats are capable of rotating around the mandril. The metal spray marking plate special for the cold and hot rolling can be cleaned by organic solution so as to be reused after using and therefore cost is effectively saved. Due to the fact that the metal spray marking plate spares a number imprinting process, spraying and coating work efficiency is improved and optimized.
Owner:BAOSTEEL DEV CO LTD

Method for repairing noble metal target material

The invention discloses a method for rehabilitating a noble metal target material. The method comprises the following steps: the noble metal target material with a sputtering loss region formed by the implementation of sputtering is subjected to alkali cleaning, oil removal, washing through clean water and dehydration through absolute ethyl alcohol; an upper protective hood and a lower protectivehood carry out the argon gas protection of inert gas on the noble metal target material; a wire material with the same texture with the target material and the local target material are melted through a tungsten electrode of an argon arc welding gun and are accumulated in the loss region; therefore, repeated accumulation is carried out so that the loss region is gradually piled flatly to finally become an accumulation state. The method has easy operation, simple process, no pollution and low cost; in the rehabilitating process, the noble metal material is hardly lost so as to realize the repeated use of the target material and substantially improve the utilization rate of the target material; the rehabilitated target material has no crack and no air hole; and the interface between the filled noble metal material and the original sputtering target is in metallurgical bonding of a welding state and have no delamination and the like.
Owner:NORTHWEST INSTITUTE FOR NON-FERROUS METAL RESEARCH

Building formwork

The invention provides a building formwork, relates to the technical field of building materials, and mainly solves the technical problem that in the prior art, a building formwork is poor in wear resistance and poor in fireproof performance. The building formwork comprises wear-resistant layers and a base layer, wherein the wear-resistant layers are positioned on the upper surface and the lower surface of the base layer; each wear-resistant layer comprises a wear-resistant surface and a reinforcing surface; each reinforcing surface comprises a channel and collateral layer; each channel and collateral layer is positioned on the surface, which is close to the base layer, of the corresponding wear-resistant layer; and each wear-resistant surface is positioned on the surface, which is away from the base layer, of the corresponding wear-resistant layer. The base layer is positioned between the wear-resistant layers, friction and/or scratching between the outside and the base layer can be prevented effectively, furthermore, the base layer can be isolated from a heat source of the outside by the wear-resistant layers, the base layer is prevented from being in direct contact with a fire source, and the fire resistance of the building formwork is improved. Each channel and collateral layer is close to the surface, which is close to the base layer, of the corresponding wear-resistant layer, the wearing capacity of the wear-resistant layers can be improved, and thus, the service life of the building formwork is prolonged.
Owner:卢志宣

Method and system for removing nitrogen oxides from low-temperature flue gas

The invention relates to a method for removing nitrogen oxides from low-temperature flue gas, which comprises the following steps of: S1, preparing at least two reactors containing a catalyst and urealoaded on the catalyst, and dividing the reactors into a reaction group and a to-be-reacted group.S2, introducing low-temperature flue gas into the reaction group for denitration reaction; introducing the low-temperature flue gas into the reaction group for denitration reactionwhen urea in the reaction group is consumed to a preset value, and supplementing the urea in the reaction group.S3, introducing the low-temperature flue gas into the to-be-reacted group for denitration reactionwhen urea in the to-be-reacted group is consumed to a preset value, and supplementing the urea in the to-be-reacted group; and S4, alternately introducing the low-temperature flue gas into the reaction group and the to-be-reacted group according to the mode so as to achieve the continuous denitration of the low-temperature flue gas.The invention also provides a system for removing nitrogen oxides from low-temperature flue gas according to the method.The removal of nitrogen oxides in low-temperature flue gas is achieved, the problem of ammonia escape is avoided, and meanwhile, the continuous denitration of low-temperature flue gas and the repeated use of the catalyst are ensured.
Owner:NORTHEASTERN UNIV

Protective cover against acid and alkali corrosion and using method thereof

The invention discloses a protection cover capable of protecting a single-face pattern of a silicon wafer from being influenced by wet etching and an application method thereof. The protection cover adopts a top plate and a bottom plate to clamp a chip which needs pattern protection in the middle, and the top plate is in sealed connection with the bottom plate through a fastening screw; rubber rings are respectively placed between the top plate and the chip and between the bottom plate and the chip, and sealing is achieved through compressive deformation of the rubber rings; a round through hole is arranged in the center of the bottom plate, and corrosive liquid corrodes the back of the chip through the through hole; a round groove is arranged in the center of a sealed upper cover board, and water is injected into the groove to prevent the corrosive liquid from seeping into the inner sides of the rubber rings to directly corrode the silicon wafer. One face of the chip, which needs protection, is soaked into other liquid by the protection cover, so that damage from wet etching is avoided. The whole structure is easy to assemble and disassemble, simple and convenient to use, and through replacing the sealing rings, the protection cover can be repeatedly used.
Owner:INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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