Memory capacitor for thin film transistor LCD and process for making same
A liquid crystal display and storage capacitor technology, which is applied to static indicators, photo-engraving processes of pattern surfaces, instruments, etc., can solve the problems of reduction of aperture ratio, image display effect and quality impact, etc., to increase aperture ratio and improve display. Effect and quality, effect of increasing permittivity
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
no. 1 example
[0039] When the present invention is applied to the storage capacitor of manufacturing amorphous silicon thin film transistor liquid crystal display, please see Figure 1A to Figure 1C .
[0040] Figure 1A to Figure 1C It is a schematic side view of the manufacturing process of the storage capacitor of the amorphous silicon thin film transistor liquid crystal display according to a first embodiment of the present invention. This embodiment can simultaneously manufacture an amorphous silicon thin film transistor on a substrate.
[0041] Please refer to Figure 1A Firstly, a first patterned metal layer is formed on the surface of the substrate 100 as the gate 102 of the amorphous silicon thin film transistor 110 , and then an insulating layer 104 is formed to cover the substrate 100 and the gate 102 thereon. Then, a channel layer 106 is formed on the insulating layer 104 across the gate 102 . After that, a second patterned metal layer including the source / drain 108 of the amor...
no. 2 example
[0046] When the present invention is applied to the storage capacitance of manufacturing polysilicon thin film transistor liquid crystal display, please see Figure 2A to Figure 2D .
[0047] Figure 2A to Figure 2D It is a schematic side view of the manufacturing process of the storage capacitor of the polysilicon thin film transistor liquid crystal display according to a second embodiment of the present invention. A polysilicon thin film transistor can be fabricated on a substrate at the same time.
[0048] Please refer to Figure 2A First, an island-shaped polysilicon (poly-island) layer 202 is formed on the substrate 200 , and then an insulating layer 206 is formed to cover the substrate 200 and the island-shaped polysilicon layer 202 thereon. After that, a first patterned metal layer is formed on the substrate 200 , including the gate 204 formed on the island-shaped polysilicon layer 202 and the lower electrode 214 adjacent to the island-shaped polysilicon layer 202 . ...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 