Flexible circuit board

A flexible circuit board and circuit technology, used in printed circuits, electrical components, cooling/ventilation/heating transformation, etc., to increase heat dissipation efficiency, improve connection reliability, and increase heat dissipation area.

Active Publication Date: 2007-02-07
CHINA STAR OPTOELECTRONICS INT HK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to solve the defects of the existing flexible printed circuit boards, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time. This is obviously a problem that the relevant industry is eager to solve.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] see figure 1As shown, it is a schematic cross-sectional view of a flexible circuit board according to the first preferred embodiment of the present invention. The flexible circuit board 100 of the present invention is suitable for carrying at least one electronic component 200, and the electronic component 200 is connected with the flexible circuit board 100, and the electronic component 200 is such as a light emitting diode component or an organic electroluminescence component. The flexible circuit board 100 includes, for example, a first insulating layer 110 , a patterned metal layer 120 , a second insulating layer 130 and a plurality of first thermal vias 124 a. Wherein, the first insulating layer 110 has a first surface 112a and a second surface 112b corresponding to the first surface 112a, and the material of the first insulating layer 110 is, for example, polyimide or other transparent insulating materials. . The patterned metal layer 120 is disposed on the firs...

Embodiment 2

[0071] see figure 2 As shown, it is a schematic top view of a flexible circuit board according to the second preferred embodiment of the present invention. This embodiment is similar to the first embodiment, but the difference is that this embodiment has a first heat dissipation pad 126, and the first heat dissipation pad 126 is connected with the connection pad 124 to increase the overall heat dissipation area, wherein the first heat dissipation pad 126 The pad 126 is made of copper, aluminum or other materials with good electrical and thermal conductivity. Therefore, the connection pad 124 can conduct part of the heat energy to the first heat dissipation pad 126 , and conduct it to the outside through the first heat dissipation pad 126 , so as to reduce the temperature of the connection pad 124 .

Embodiment 3

[0073] see image 3 Shown is a schematic top view of a flexible printed circuit board according to the third preferred embodiment of the present invention, please also refer to figure 1 and image 3 As shown, this embodiment is similar to the second embodiment, but the difference is that: the flexible circuit board 100 of this embodiment has a plurality of second heat conduction vias 126a, and the second heat conduction vias 126a are located on the first heat dissipation pad 126 , wherein the second thermal via 126 a penetrates through the first insulating layer 110 , the patterned metal layer 120 , the second insulating layer 130 and the heat dissipation metal film 140 . Therefore, the above-mentioned second heat conduction vias 126 a can also increase the heat dissipation area of ​​the first heat dissipation pad 126 , thereby increasing the heat dissipation efficiency of the first heat dissipation pad 126 , so as to achieve the purpose of the present invention.

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PUM

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Abstract

This invention relates to a soft CB used in loading an electronic component including a first insulation layer, a pattern metal layer, a second insulation layer and multiple heat-conduction through-holes, among which, the metal layer is set on a surface of the first insulation layer containing multiple connection pads and a pattern circuit connected with the pads. Besides, the second insulation layer is matched on the first, covers the metal layer and has multiple connection opens for exposing part regions of the pads. The heat-conduction through-holes are placed at the places of the pads.

Description

technical field [0001] The present invention relates to a flexible printed circuit (FPC), in particular to a flexible printed circuit with thermal through holes. Background technique [0002] The traditional cathode ray display (Cathode Ray Tube, CRT) has the advantages of mature process technology and complete related upstream, midstream and downstream industries. The CRT display uses cathode ray discharge to generate images. Cathode rays can potentially affect the eyes, so Liquid Crystal Display (LCD), Organic Light Emitting Display (OLED) or Plasma Display Panel (PDP) has the advantages of low power consumption, low radiation, and high display quality. It has gradually become the mainstream of display products. [0003] As far as liquid crystal displays are concerned, they can be roughly divided into three types: reflective LCDs, transmissive LCDs, and transmissive LCDs, according to their light source utilization patterns. Taking a transmissive or transflective liquid ...

Claims

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Application Information

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IPC IPC(8): H05K1/00H05K7/20
Inventor 何雅婷张哲誌
Owner CHINA STAR OPTOELECTRONICS INT HK
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