A 7D printing system and printing method thereof

A printing system and host system technology, which is applied to other home appliances, 3D object support structures, and electrical components to assemble printed circuits, etc., can solve the problems of many equipment, complex systems, poor sealing, etc. Fewer parts and improved short-circuit resistance

Active Publication Date: 2019-08-13
转录科技(深圳)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the above problems, the present invention provides a 7D printing system and its printing method, which solves the defects of the prior art in the production of electronic products, the equipment used is many, the system is complex, and the electronic products produced are not well sealed.

Method used

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  • A 7D printing system and printing method thereof
  • A 7D printing system and printing method thereof
  • A 7D printing system and printing method thereof

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Embodiment Construction

[0031] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will be described in detail in conjunction with the accompanying drawings and specific embodiments. The following embodiments are used to illustrate the present invention, but not to limit the scope of the present invention.

[0032] refer to figure 1 , figure 2 As shown, a 7D printing system includes a raw material unit 9, a plastic bottom shell forming unit 3, a component printing unit 5, a conductive material printing unit 7, and a host system 2; wherein:

[0033] The raw material unit 9 is used to store various insulating materials and circuit printing materials;

[0034] The plastic bottom shell molding unit 3 is connected to the host system 2, and is used to print the insulating material in the raw material unit into a casing of an electronic product;

[0035] The component printing unit 5 is connected to the host system 2, an...

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Abstract

The invention discloses a 7D printing system and a printing method thereof. The 7D printing system comprises a raw material unit, a plastic bottom shell forming unit, a component printing unit, a conductive material printing unit and a main machine system, wherein, the raw material unit is used for storing various insulating materials and circuit printing materials, the plastic bottom shell forming unit is connected with the main machine system and used for printing the insulating materials in the raw material unit into shell bodies of electronic products, the component printing unit is connected with the main machine system and used for printing the circuit printing materials in the raw material unit into all the components in the electronic products, the conductive material printing unit is connected with the main machine system and used for electrically connecting the printed components, and the7D printing system has the effects that the cost is low; constituent parts are few, the equipment cost is much less than investment of the prior art, and the leakproofness is good; by means of the 7D printing system, the shell bodies of products are directly printed and packed, fixing is achieved without using traditional screws, and the sealing performance, waterproofness and short-circuit-proof capacity of the products are improved.

Description

technical field [0001] The invention belongs to the technical field of printers, and in particular relates to a 7D printing system and a printing method thereof. Background technique [0002] Three-dimensional printing is a kind of rapid prototyping technology. It is based on digital model files and uses liquid, powder or sheet metal, plastic and other materials to construct objects by printing layer by layer from bottom to top. 3D printing is usually realized by using digital technology material printers. It is often used to manufacture models in the fields of mold manufacturing and industrial design. Later, it is gradually used in the direct manufacturing of some products. Currently, this 3D printing technology has been used Printed parts. [0003] At present, in the process of manufacturing electronic products, large-scale equipment such as complete sets of PCB equipment and SMT reflow welding are required, and the production cost of these equipment is extremely high, th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C64/118B29C64/20B29C64/295B29C64/393H05K3/34B33Y10/00B33Y30/00B33Y50/02B29L31/34
CPCB29L2031/3425B29L2031/3481B33Y10/00B33Y30/00B33Y50/02H05K3/34
Inventor 付兵丁艳梅
Owner 转录科技(深圳)有限公司
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