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Mini refrigeration system for computer chip heat radiating

A chip heat dissipation and refrigeration system technology, applied in computing, energy-saving computing, sustainable buildings, etc.

Inactive Publication Date: 2007-02-28
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] As mentioned earlier, technologies for cooling CPU chips by air cooling, water cooling, and phase change have been developed, but there is no method for actively cooling CPU chips by using micro-refrigeration systems, especially vapor compression refrigeration systems. A system for cooling multiple heat-generating components has not been reported so far, so the present invention is expected to establish a refrigeration system with a variety of functions and the ability to cool multiple heat-generating components at the same time. It is compact in structure and easy to use. Simple and reliable refrigeration system

Method used

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  • Mini refrigeration system for computer chip heat radiating
  • Mini refrigeration system for computer chip heat radiating
  • Mini refrigeration system for computer chip heat radiating

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Embodiment Construction

[0037] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0038] Fig. 1 is a structural representation of the present invention; Fig. 2 is the schematic diagram of the refrigeration cycle of the miniature refrigeration system used for computer chip heat dissipation of the present invention; As can be seen from the figure, the microrefrigeration system used for computer chip heat dissipation of the present invention comprises: Machine 1, condenser 2, dry filter 4, capillary tube and evaporator, liquid separator 13, control circuit 19; compressor 1 is connected with condenser 2, and condenser 2 is connected with capillary tube and evaporator through dry filter 4 The evaporator communicates with the compressor 1 through the liquid separator 13 to form a refrigeration circuit;

[0039] The evaporator is a single-stage or multi-stage evaporator connected in parallel / series or series-parallel mixe...

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Abstract

The invention is a microtype refrigerating system used in cooling computer chips, and its structure: a compressor is connected with a condenser, the condenser is connected with a capillary tube and an evaporator through a dry filter, the evaporator is connected with the compressor through a liquid separator to form a refrigerating loop; the evaporator is a single-stage or multistage evaporator connected in parallel, in series or in parallel and series on connection pipelines between the dry filter and separating tube, the capillary tube is connected on the preposed connection pipeline of each-stage evaporator; the compressor is vapour compression refrigerator, absorbing refrigerator, steam jet refrigerator, compressed air refrigerator, air vortex refrigerator or Stering refrigerator, Vuilleumier refrigerator or GM refrigerator, etc, where the refrigerating capacity is 10-2000W, and the input power is 10-400W, based on mechanical refrigeration and simultaneously actively cooling many heating parts in the computer, and suitable for the requirement of continuously upgrading the computer, and the whole system is small-sized and low-energy consumption, largely lowers the temperature, and has a compact structure, high reliability, and simple operation.

Description

technical field [0001] The invention relates to a micro-refrigeration system, in particular to a micro-refrigeration system for actively cooling multiple chip parts of a computer based on mechanical refrigeration. Background technique [0002] In recent years, computer applications have become quite common due to the enhancement of the computing power of microprocessors and the dramatic reduction in prices. Computational processing used to be performed by main computers located in isolated computer rooms, but more and more offices are now equipped with personal computers. An important issue that follows is how to quickly and effectively dissipate the high heat generated in these systems. Some computer chip manufacturers such as Intel and AMD are constantly integrating more and more transistors in their chips. For example, a Pentium 4 chip packs 42 million transistors into a space no bigger than a postage stamp. Such a high level of integration will inevitably generate a l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/44G06F1/20
CPCY02B60/1275Y02D10/00
Inventor 刘静吕永钢
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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