Supercharge Your Innovation With Domain-Expert AI Agents!

Ball grid array package

A ball grid array and solder ball technology, applied in the field of ball grid array packages and interventions, can solve problems such as difficulty in removing solder

Inactive Publication Date: 2007-07-11
HONEYWELL INT INC
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This makes it difficult to remove the solder after soldering

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ball grid array package
  • Ball grid array package
  • Ball grid array package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019]A BGA package in accordance with the principles of the present invention is shown in the drawings and generally indicated at 10 . BGA package 10 includes a land grid array (LGA) package 12 for receiving an integrated circuit (IC) die or chip 14 and includes a domed lid 19 . Chip 14 is electrically connected to pads 18 by wires 16 and then to contact pads 22 on surface 23 of LGA package 12 by internal wires 20 . The present invention includes an interposer 30 between the LGA package 12 and the PCB 25 . Connections 26 and 28 formed by reflowed solder connect to LGA package 12 and PCB 25 at contact pads 22 and 24, respectively. Referring to Figures 2 and 3, the interposer 30 comprises a flexible substrate 32 made of polyimide or similar material having a top surface 34, a bottom surface 36 and a hole 40 formed through the substrate 32. The conductive paths 38 are relatively closely spaced. The flexible substrate 32 is made of polyimide or similar material, and has a typi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A ball grid array mounted circuit (10) includes a stress relief substrate (32) having spaced conductive vias (38) extending between its surfaces (34, 36) and connection pads (46, 48) at the surfaces. Solder connections (26) formed from solder balls connect between pads at the top surface and connection pads (22) at an electronic component (12). Solder connections (28) formed from solder balls connect between pads (48) at the bottom surface and connection pads (24) at a printed circuit board (PCB) (25). The solder connections absorb at teast a portion of the stress due to differences between the thermal coefficient of expansion of the electronic component and the PCB.

Description

technical field [0001] The present invention relates generally to integrated circuit packages and, more particularly, to ball grid array (BGA) packages. In particular, the present invention relates to an interposer employed in a ball grid array package. Background technique [0002] Due to the emphasis on reducing the physical size and increasing complexity of electronic components, there is a continuing need to provide integrated circuit packages with smaller footprints, higher lead densities, and improved electrical and thermal characteristics. Ball grid array (BGA) packages have been used to meet the demand for integrated circuit packages with higher lead density and smaller footprint. A typical BGA package is a square package that contains some wires that lead the chip connections to the outer surface and connect to the connection pads. Solder balls are placed between the package pads and corresponding pads on the printed circuit board (PCB) and reflowed to form a perm...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/14H05K1/11H01L23/32H01L21/60H05K3/34
CPCH01L2924/01322H05K2201/10378H01L2924/15311H05K2201/068H01L2924/01078H01L2924/16152H01L2924/01004H01L2924/01079H01L2224/48091H05K3/3436H05K1/141Y02P70/50H01L2924/00014H05K1/14
Inventor R·K·斯皮尔伯格T·G·瓦纳R·J·詹森
Owner HONEYWELL INT INC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com